Research Groups

October 18, 2017

Sub-10nm finFETs to feature at IEDM

Intel and GlobalFoundries will talk about their post-14nm finFET-based processes at December's IEDM.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations: , , ,
May 2, 2017

Wally Rhines looks beyond ‘endless verification’ to the system era

DVCon China saw Mentor's chairman and CEO give a typically thorough keynote on the evolving challenges for verification.
February 13, 2017

SPIE Advanced Lithography preview: Mentor Graphics

The major West Coast technical conference for lithography is just two weeks away and offers a packed agenda.
December 7, 2016

IMEC stacks nanowire transistors together on CMOS

IMEC has claimed at IEDM to have implemented for the first time the CMOS integration of vertically stacked nanowire transistors.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations:
December 7, 2016

Overcoming electromigration analysis limitations for larger on-die power grids

Award-winning paper describes new strategy offering both greater speed and accuracy.
Article  |  Topics: Blog Topics  |  Tags: , , ,   |  Organizations: , ,
June 9, 2016

2D tools adapt to create smaller monolithic 3DIC designs

Researchers at the Georgia Institute of Technology adapted conventional 2D layout tools to a two-layer monolithic 3D process that resulted in sizeable space and power savings.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations:
June 8, 2016

Minimize memory moves for greener data centers

Deep pipelines and dynamic memory sharing may provide the key to the development of faster and more efficient server-farm blades as the focus in hardware design moves to augmenting conventional processors with specialized accelerators.
April 7, 2016

SNUG 2016: Intel, TSMC, GloFo back post-finFET research at UC Berkeley

But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.
March 11, 2016

GSA on how to reinvigorate silicon business models

Open-source hardware, in-field configurability, and a hardware-plus-services approach could protect margins as the IoT hammers down costs, says GSA report.
December 15, 2015

GaN power makes progress at IEDM 2015

Researchers describe at IEDM 2015 how they are making gallium nitride fit into a wider range of power-handling applications and may even result in mass-market vertical transistors.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , ,   |  Organizations: ,

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