Silicon Photonics 3D integration posed LVS challenges in this fast emerging technical space. A case study describes how the two institutions overcame them.
Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.
Siemens EDA has become the first of the major EDA vendors to join the DARPA Toolbox Initiative.
Imec showed at VLSI Symposia a process flow that can cut the gap between complementary transistors to less than 20nm.
At the VLSI Symposia, researchers described how AI hardware could help dramatically accelerate analog and digital design and not all of it directly through machine learning.
The upcoming VLSI Symposia will feature a number of papers that show the ways in which novel approaches are going to be needed to continue scaling.
The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.
Work by the University of Toronto and Arm presented at IEDM indicates plasmonics could be a viable contender for high-speed chip-chip communications.
Work presented at IEDM 2020 shows taking advantage of the IC backside for power and ground for the additional area can deliver further benefits for IR drop and security.
Imec's senior vice president of CMOS outlined future directions for the technology over the coming decade.
View All Sponsors