Research Groups

July 18, 2022

Open-source EDA grapples with the incentives issue

As the project that funded OpenRoad draws to a close, experts pondered its wider future at the 59th DAC.
June 1, 2022

Oxide DRAM gains traction at VLSI Symposium

VLSI Symposium 2022 will show the rapid development taking place in oxide-based replacements for traditional DRAM cells as well as the emerging area of memory-based low-power machine learning.
January 25, 2022

Silicon Photonics verification case study from UC-Davis and Texas A&M

Silicon Photonics 3D integration posed LVS challenges in this fast emerging technical space. A case study describes how the two institutions overcame them.
Article  |  Topics: Verification  |  Tags: , ,   |  Organizations: , ,
October 18, 2021

Three ways to 3D feature at IEDM

Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: , , ,
September 24, 2021

Siemens brings chip-design flow to DARPA Toolbox Initiative

Siemens EDA has become the first of the major EDA vendors to join the DARPA Toolbox Initiative.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , ,   |  Organizations: , , , ,
June 15, 2021

Imec cuts transistor gap to less than 20nm with forksheets

Imec showed at VLSI Symposia a process flow that can cut the gap between complementary transistors to less than 20nm.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations:
June 14, 2021

AI’s design speedups, with and without machine learning

At the VLSI Symposia, researchers described how AI hardware could help dramatically accelerate analog and digital design and not all of it directly through machine learning.
May 2, 2021

Alternative scaling approaches form VLSI 2021 technology highlights

The upcoming VLSI Symposia will feature a number of papers that show the ways in which novel approaches are going to be needed to continue scaling.
January 15, 2021

Copper’s future is troubled but it’s likely to stick around

The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations: , , , ,
December 21, 2020

Plasmonics may point way to faster interchip comms

Work by the University of Toronto and Arm presented at IEDM indicates plasmonics could be a viable contender for high-speed chip-chip communications.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , , ,   |  Organizations: ,

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