ESD Alliance to describe system shift at DVCon Europe
Electronic System Design Alliance executive director Bob Smith is to be be the keynote speaker during the DVCon Europe gala dinner.
post-Moore
IEDM alters schedule to keep abreast of process updates
The International Electron Device Meeting has pushed back the deadline for its papers to get the latest developments in process and device design into the December conference.
SNUG 2016: Intel, TSMC, GloFo back post-finFET research at UC Berkeley
But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.
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