Commentary

October 7, 2019

Master the design and verification of next gen transport: Part Four – emulation

Emulation is already playing a vital role in advanced automotive design within a digital twin environment.
September 3, 2019
Joe Sawicki, EVP for IC EDA, Mentor. 'AI inside' analysis

EDA with ‘AI inside’ – Mentor’s Joe Sawicki offers an insider’s view

Mentor has a host of tools - some public, some not - that leverage AI and ML. EVP Joe Sawicki has been describing the strategy behind their development.
September 2, 2019

South Korea-Japan tensions continue to threaten memory supply chain

Concerns that the diplomatic stand-off between Seoul and Tokyo could hit the supply chain rose again this weekend as South Korean politicians made a surprise visit to disputed islands.
April 26, 2019

The evolution of the digital twin

A digital twin is now more than just a virtual copy of a product. For Siemens, it is a multilayered concept powering a 'boundary-free innovation platform'.
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March 12, 2019

Mastering automotive complexity through generative design

The trend toward Level 5 fully autonomous vehicles poses major complexity, cost and change issues that Generative Design flows aim to address.
March 11, 2019

China Focus 3: The R&D template

5G has given Beijing a development template to use across its Made in China 2025 program.
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February 25, 2019

China Focus 2: The Design Dilemma

Do China's ambitions as a world-class innovator face fundamental challenges as a result of the sector's existing economic infrastructure?
December 22, 2017

Toward the ISO26262 update: Still fighting an old war?

A new version of automotive safety standard ISO 26262 is due in 2018 but how close to Level 5 autonomy will it actually take us? And what about security?
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March 24, 2017

The return of the CEO Outlook

The ESD Alliance is relaunching the annual panel session featuring CEOs from ARM, Cadence Design Systems, Mentor Graphics and Synopsys in Mountain View on April 9.
November 15, 2016

Siemens agrees deal to buy Mentor Graphics

German industrial conglomerate to pay $4.5B to extend its PLM division into electronic chip and systems design.

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