CEA-Leti

At IEDM, CEA-Leti described a process that avoids the thermal problems of implementing CMOS transistors in the metal stack using monolithic integration.

Applied Materials and CEA-Leti have expanded their collaboration with the creation of a joint lab to develop materials useful for sensors, RF communications, and power devices, and with a focus on heterogeneous integration.

As 2D scaling becomes increasingly difficult, researchers reporting at VLSI Symposia have focused attention on what can be done in the third dimensions to improve density and performance without a sudden break from conventional CMOS processes.

Adaptive power-aware clocking and buried rails are among the techniques to be explored at the 2020 VLSI Symposia.

There's still plenty of time to build a busy and profitable agenda for a visit to ES Design West and SEMICON West in San Francisco next week.

It's been a long time coming, but silicon photonics is now entering commercial design for networking and grabbing attention in autonomous driving and sensors.

CEA-Leti claimed at IEDM to have achieved major steps in bringing monolithic 3D integration closer to production readiness.

The LightSuite Compiler produces designs based on Python descriptions and certifies them DRC-clean through hooks into the market-leading Calibre DFM suite.

Research institute Leti and low-volume wafer service CMP are cooperating on a project to let fabless chipmakers explore the use of non-volatile resistive RAMs in their designs.

Research institute Leti and Soitec have decided to team up to work on a new generation of engineered substrates, such as specialized SOI wafers.