CEA-Leti

June 16, 2020

Transistor stacks piled high at VLSI

As 2D scaling becomes increasingly difficult, researchers reporting at VLSI Symposia have focused attention on what can be done in the third dimensions to improve density and performance without a sudden break from conventional CMOS processes.
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May 26, 2020

Nanometer scaling puts focus on power at VLSI in June

Adaptive power-aware clocking and buried rails are among the techniques to be explored at the 2020 VLSI Symposia.
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July 2, 2019

The road to ES Design West: Location, location, location

There's still plenty of time to build a busy and profitable agenda for a visit to ES Design West and SEMICON West in San Francisco next week.
January 31, 2019

Creating a $4B market for silicon photonics

It's been a long time coming, but silicon photonics is now entering commercial design for networking and grabbing attention in autonomous driving and sensors.
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December 5, 2018

Leti takes the heat off monolithic 3D

CEA-Leti claimed at IEDM to have achieved major steps in bringing monolithic 3D integration closer to production readiness.
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September 12, 2018

Mentor automates silicon photonics layout

The LightSuite Compiler produces designs based on Python descriptions and certifies them DRC-clean through hooks into the market-leading Calibre DFM suite.
August 3, 2018

MPW service arrives for RRAM

Research institute Leti and low-volume wafer service CMP are cooperating on a project to let fabless chipmakers explore the use of non-volatile resistive RAMs in their designs.
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July 11, 2018

Leti and Soitec partner for wafer development

Research institute Leti and Soitec have decided to team up to work on a new generation of engineered substrates, such as specialized SOI wafers.
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April 5, 2018

Leti releases photonics design kit for Synopsys PhoeniX OptoDesigner suite

PDK enables photonics prototyping on MPW runs and compatibility with volume production at STMicroelectronics at Crolles.
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December 6, 2017

European teams explore 3D integration tradeoffs

Two leading European research institutes presented their work on the feasibility and cost-effectiveness of monolithic 3D integration at this year's IEDM.
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