The OSDA Workgroup formed by Netronome and others is looking to adopt the PIPE standard for interconnecting chiplets as it starts work on a proof-of-concept module.
The Design Automation Conference (DAC) has kicked off free registration for the exhibit floor at early June's Las Vegas event.
MACOM has decided to use GlobalFoundries' 90nm SOI process on 300mm wafers to build higher-integration optical-switching devices for servers.
The company will share a stand at EmbeddedWorld in Nuremberg with its sister Siemens division Polarion and has seven papers across the technical program.
Mentor's flagship PCB suite is aiming to offer another 'shift left' in verification as respins rise.
Data-center networking specialist Netronome has recruited a number of silicon makers and IP suppliers to a standard for chiplet designs that can be used in SIPs for edge computers and servers.
Suppliers to the embedded industry see modules and readymade software as being key to getting IoT projects off the ground.
Yokogawa has moved to a modular architecture to handle the growing number of complex applications that are emerging in power testing.
Dialog Semiconductor aims to expand its use of configurable mixed-signal circuitry across its product line following its acquisition of specialist Silego a year ago.
It’s the back-end that needs work as system-level considerations begin to dominate design, Qualcomm’s vice president of engineering said at DAC.
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