PCB

March 18, 2019

PCI may provide key to OCP chiplet standard

The OSDA Workgroup formed by Netronome and others is looking to adopt the PIPE standard for interconnecting chiplets as it starts work on a proof-of-concept module.
March 12, 2019

Free registration opens for DAC

The Design Automation Conference (DAC) has kicked off free registration for the exhibit floor at early June's Las Vegas event.
March 6, 2019

MACOM to use GlobalFoundries 300mm SOI for PICs

MACOM has decided to use GlobalFoundries' 90nm SOI process on 300mm wafers to build higher-integration optical-switching devices for servers.
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February 21, 2019

EmbeddedWorld 2019 preview: Mentor

The company will share a stand at EmbeddedWorld in Nuremberg with its sister Siemens division Polarion and has seven papers across the technical program.
November 15, 2018

Xpedition updated for schematic verification and DFT

Mentor's flagship PCB suite is aiming to offer another 'shift left' in verification as respins rise.
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November 6, 2018

Netronome launches chiplet initiative for network-accelerator SIPs

Data-center networking specialist Netronome has recruited a number of silicon makers and IP suppliers to a standard for chiplet designs that can be used in SIPs for edge computers and servers.
September 24, 2018

Module strategies try to streamline IoT trials

Suppliers to the embedded industry see modules and readymade software as being key to getting IoT projects off the ground.
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September 21, 2018

Power analyzer takes rates up to 5MHz

Yokogawa has moved to a modular architecture to handle the growing number of complex applications that are emerging in power testing.
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September 19, 2018

Dialog plans configurable mixed-signal expansion

Dialog Semiconductor aims to expand its use of configurable mixed-signal circuitry across its product line following its acquisition of specialist Silego a year ago.
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June 27, 2018

EDA needs to work on the back end, says Qualcomm

It’s the back-end that needs work as system-level considerations begin to dominate design, Qualcomm’s vice president of engineering said at DAC.
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