Achronix is introducing an FPGA architecture that pulls a full network-on-chip into the programmable-logic fabric combined with hardened matrix-math processors for AI.
A digital twin is now more than just a virtual copy of a product. For Siemens, it is a multilayered concept powering a 'boundary-free innovation platform'.
Mentor's technical conference will take place on May 2 at the Santa Clara Marriott and feature more than 45 user and vendor presentations.
An Open Compute Project group working on multichip integration sees a combination of parallel and serial interfaces being important for interchip communication.
Cadence has launched a web-based EDA service the company hopes will ease the transition from self-hosted computing to more flexible cloud-based development.
UK-based Trackwise has shipped what could easily be the longest ever flexible PCB with a 26m-long substrate to deliver power and control to a UAV's wings.
The ODSA Workgroup formed by Netronome and others is looking to adopt the PIPE standard for interconnecting chiplets as it starts work on a proof-of-concept module.
The Design Automation Conference (DAC) has kicked off free registration for the exhibit floor at early June's Las Vegas event.
MACOM has decided to use GlobalFoundries' 90nm SOI process on 300mm wafers to build higher-integration optical-switching devices for servers.
The company will share a stand at EmbeddedWorld in Nuremberg with its sister Siemens division Polarion and has seven papers across the technical program.
View All Sponsors