PCB

March 13, 2022

Learn strategies for better measurement and test in simulation-based PCB design

A new white paper offers useful tips and techniques for PDN analysis and performance optimization in designs such as those using DDR4.
Article  |  Tags: , , , , ,   |  Organizations:
December 31, 2021

AMD moves gradually into 3D integration

At December's Design Automation Conference, AMD senior vice president Sam Naffziger provided more insights into the chipmaker’s use of chiplet-based design and manufacture.
Article  |  Tags: , , , , , , ,   |  Organizations:
December 9, 2021

Flexible hybrid electronics: Making an emerging tech happen with PDKs and reference designs

FHE use-cases are evolving and the NextFlex consortium is looking to smooth their path with a strategy, PDKs and reference modules.
November 8, 2021

Chiplets may have to prove themselves for secure operation

University of Florida researcher proposes third-party checks on chiplets to demonstrate they are free of trojans.
Article  |  Tags: , , , ,   |  Organizations:
October 26, 2021

Arm SystemReady adjusts to compatibility issues

Arm’s SystemReady program has revealed a number of the subtleties involved when trying to maintain software compatibility with operating systems without moving to the straightjacket of platforms like those used for the x86-based PC.
Article  |  Tags: , , , ,   |  Organizations:
October 22, 2021

Digitalization beyond the enterprise

What companies do internally to digitalize matters, but so does using the concept to optimize their supply chain with partners.
October 7, 2021

Combined database underpins 3DIC design suite

Cadence has built a unified database to support a group of tools to support the planning and implementation of 3DIC designs.
July 19, 2021

Chiplet design raises big questions

Building products using chiplets involves more than treating them as hard IP cores. Many open questions surround the field, explored by panelists in a MEPTEC conference online.
Article  |  Tags: , , , ,   |  Organizations: , , ,
June 17, 2021

Standard arrives for thermal simulation data

A de facto standard for exchanging thermal information about designs has become JEDEC standard JEP181.
April 6, 2021

Siemens cloud tool streamlines DFM for PCBs

Siemens has introduced a cloud-based DFM tool intended to bridge the gap between the electronics design and manufacturing.
Article  |  Tags: , , , ,   |  Organizations:

PLATINUM SPONSORS

Synopsys Cadence Design Systems Siemens EDA
View All Sponsors