PCB

April 6, 2021

Siemens cloud tool streamlines DFM for PCBs

Siemens has introduced a cloud-based DFM tool intended to bridge the gap between the electronics design and manufacturing.
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February 10, 2021

Instrument sync underpins scopecorder development

Yokogawa's development of a data-recording oscilloscope is built around the ability to connect instruments together and synchronize their measurements.
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January 19, 2021

Design house recommends earlier start to flip-chip bump layout

Design-services company Sondrel is recommending teams start earlier on package design to avoid delays after IC tapeout.
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December 21, 2020

Plasmonics may point way to faster interchip comms

Work by the University of Toronto and Arm presented at IEDM indicates plasmonics could be a viable contender for high-speed chip-chip communications.
December 14, 2020

Mentor rebrands as Siemens EDA

Mentor, a Siemens business, has rebranded as Siemens EDA, almost almost four years after the EDA company was acquired.
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October 29, 2020

User2User sets virtual 2020 dates: US in November, Europe in December

The free-to-attend user meetings for Mentor clients will retain the same format mixing technical presentations with keynotes and networking.
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August 12, 2020

How to handle PCB constraints for IoT designs

An RF Laboratories engineer provides some tips and techniques in the context of the PADS Professional suite.
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July 31, 2020

Open-RAN puts more focus on emulation in testing programs

Recent developments have made Open-RAN look more attractive as a way of implementing 5G systems. This is helping to drive a shift-left in verification and test.
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June 18, 2020

Kioxia looks to waferscale flash drives for fast, low-cost storage

Waferscale SSDs are among the future drive architectures being explored by Kioxia, according to a keynote delivered at VLSI Symposia.
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May 15, 2020

Coronavirus Resources: Mentor

Live and on-demand videos as well as You Tube 'tips and techniques' clips form part of a wide 'work at home' support package from Mentor.
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