December 1, 2022
The key to exploiting AI is being clear about where its family of technologies can help to improve and democratize design.
November 23, 2022
The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.
July 19, 2022
Teledyne e2v has demonstrated a prototype optical link that the company believes could replace electrical signaling for remote RF heads.
March 13, 2022
A new white paper offers useful tips and techniques for PDN analysis and performance optimization in designs such as those using DDR4.
December 31, 2021
At December's Design Automation Conference, AMD senior vice president Sam Naffziger provided more insights into the chipmaker’s use of chiplet-based design and manufacture.
December 9, 2021
FHE use-cases are evolving and the NextFlex consortium is looking to smooth their path with a strategy, PDKs and reference modules.
November 8, 2021
University of Florida researcher proposes third-party checks on chiplets to demonstrate they are free of trojans.
October 26, 2021
Arm’s SystemReady program has revealed a number of the subtleties involved when trying to maintain software compatibility with operating systems without moving to the straightjacket of platforms like those used for the x86-based PC.
October 22, 2021
What companies do internally to digitalize matters, but so does using the concept to optimize their supply chain with partners.
October 7, 2021
Cadence has built a unified database to support a group of tools to support the planning and implementation of 3DIC designs.