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January 7, 2020

Siemens and Arm combine to extend digital twin further into SoC design

Partnership combines Siemens PAVE 360 digital twin with ARM IP, including dedicated automotive offerings, to speed and streamline design toward Level 5.
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December 18, 2019

Capacitive link to power cheap wireless tags

Imec, TNO, and Cartamundi have developed a low-cost way of letting tags communicate with embedded devices wirelessly by using a capacitive touchscreen.
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December 4, 2019

Cadence to acquire AWR from National Instruments

Cadence Design Systems has agreed to buy the AWR RF-design company from its current owner National Instruments for approximately $160m.
September 23, 2019

Automating wire-harness development

Harness manufacture in automotive remains manually intensive but model-based engineering provides a way to streamline the processes to make them more efficient, a Mentor white paper claims.
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September 18, 2019

Cadence expands system analysis to thermal

Cadence has followed its launched of a parallelizable EM simulator with one that focuses on the thermal behavior of ICs through to multi-PCB assemblies.
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September 11, 2019

Embedded design meets low-code in Siemens integration plans

Siemens is combining recent acquisitions in novel ways, including one that will see a web-app development package interact more closely with Mentor's embedded offerings.
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September 10, 2019

Digital twin points the way to system-level vehicle safety

The digital-twin concept provides several avenues to achieving better safety analysis and is likely to benefit from Siemens' integration of Mentor activities.
September 2, 2019

South Korea-Japan tensions continue to threaten memory supply chain

Concerns that the diplomatic stand-off between Seoul and Tokyo could hit the supply chain rose again this weekend as South Korean politicians made a surprise visit to disputed islands.
May 21, 2019

Achronix deploys network on chip for faster FPGAs

Achronix is introducing an FPGA architecture that pulls a full network-on-chip into the programmable-logic fabric combined with hardened matrix-math processors for AI.
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April 26, 2019

The evolution of the digital twin

A digital twin is now more than just a virtual copy of a product. For Siemens, it is a multilayered concept powering a 'boundary-free innovation platform'.
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