PCB

October 7, 2021

Combined database underpins 3DIC design suite

Cadence has built a unified database to support a group of tools to support the planning and implementation of 3DIC designs.
July 19, 2021

Chiplet design raises big questions

Building products using chiplets involves more than treating them as hard IP cores. Many open questions surround the field, explored by panelists in a MEPTEC conference online.
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June 17, 2021

Standard arrives for thermal simulation data

A de facto standard for exchanging thermal information about designs has become JEDEC standard JEP181.
April 6, 2021

Siemens cloud tool streamlines DFM for PCBs

Siemens has introduced a cloud-based DFM tool intended to bridge the gap between the electronics design and manufacturing.
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February 10, 2021

Instrument sync underpins scopecorder development

Yokogawa's development of a data-recording oscilloscope is built around the ability to connect instruments together and synchronize their measurements.
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January 19, 2021

Design house recommends earlier start to flip-chip bump layout

Design-services company Sondrel is recommending teams start earlier on package design to avoid delays after IC tapeout.
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December 21, 2020

Plasmonics may point way to faster interchip comms

Work by the University of Toronto and Arm presented at IEDM indicates plasmonics could be a viable contender for high-speed chip-chip communications.
December 14, 2020

Mentor rebrands as Siemens EDA

Mentor, a Siemens business, has rebranded as Siemens EDA, almost almost four years after the EDA company was acquired.
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October 29, 2020

User2User sets virtual 2020 dates: US in November, Europe in December

The free-to-attend user meetings for Mentor clients will retain the same format mixing technical presentations with keynotes and networking.
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August 12, 2020

How to handle PCB constraints for IoT designs

An RF Laboratories engineer provides some tips and techniques in the context of the PADS Professional suite.
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