Identifying AI opportunities in PCB design
The key to exploiting AI is being clear about where its family of technologies can help to improve and democratize design.
PCB
Chipletz pushes packaging design for AI, HPC and immersive use-cases
The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.
Teledyne pushes for optical for remote RF heads
Teledyne e2v has demonstrated a prototype optical link that the company believes could replace electrical signaling for remote RF heads.
Learn strategies for better measurement and test in simulation-based PCB design
A new white paper offers useful tips and techniques for PDN analysis and performance optimization in designs such as those using DDR4.
AMD moves gradually into 3D integration
At December's Design Automation Conference, AMD senior vice president Sam Naffziger provided more insights into the chipmaker’s use of chiplet-based design and manufacture.
Flexible hybrid electronics: Making an emerging tech happen with PDKs and reference designs
FHE use-cases are evolving and the NextFlex consortium is looking to smooth their path with a strategy, PDKs and reference modules.
Chiplets may have to prove themselves for secure operation
University of Florida researcher proposes third-party checks on chiplets to demonstrate they are free of trojans.
Arm SystemReady adjusts to compatibility issues
Arm’s SystemReady program has revealed a number of the subtleties involved when trying to maintain software compatibility with operating systems without moving to the straightjacket of platforms like those used for the x86-based PC.
Digitalization beyond the enterprise
What companies do internally to digitalize matters, but so does using the concept to optimize their supply chain with partners.
Combined database underpins 3DIC design suite
Cadence has built a unified database to support a group of tools to support the planning and implementation of 3DIC designs.
PLATINUM SPONSORS
View All Sponsors