PCB

April 18, 2019

User2User Silicon Valley is two weeks away

Mentor's technical conference will take place on May 2 at the Santa Clara Marriott and feature more than 45 user and vendor presentations.
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April 4, 2019

ODSA weighs options for chiplet interconnect

An Open Compute Project group working on multichip integration sees a combination of parallel and serial interfaces being important for interchip communication.
April 2, 2019

Cadence presents plan for piecemeal cloud compute

Cadence has launched a web-based EDA service the company hopes will ease the transition from self-hosted computing to more flexible cloud-based development.
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March 26, 2019

Flexible PCB stretches across UAV’s wings for lower weight

UK-based Trackwise has shipped what could easily be the longest ever flexible PCB with a 26m-long substrate to deliver power and control to a UAV's wings.
March 18, 2019

PCI may provide key to OCP chiplet standard

The ODSA Workgroup formed by Netronome and others is looking to adopt the PIPE standard for interconnecting chiplets as it starts work on a proof-of-concept module.
March 12, 2019

Free registration opens for DAC

The Design Automation Conference (DAC) has kicked off free registration for the exhibit floor at early June's Las Vegas event.
March 6, 2019

MACOM to use GlobalFoundries 300mm SOI for PICs

MACOM has decided to use GlobalFoundries' 90nm SOI process on 300mm wafers to build higher-integration optical-switching devices for servers.
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February 21, 2019

EmbeddedWorld 2019 preview: Mentor

The company will share a stand at EmbeddedWorld in Nuremberg with its sister Siemens division Polarion and has seven papers across the technical program.
November 15, 2018

Xpedition updated for schematic verification and DFT

Mentor's flagship PCB suite is aiming to offer another 'shift left' in verification as respins rise.
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November 6, 2018

Netronome launches chiplet initiative for network-accelerator SIPs

Data-center networking specialist Netronome has recruited a number of silicon makers and IP suppliers to a standard for chiplet designs that can be used in SIPs for edge computers and servers.

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