PCB

August 12, 2020

How to handle PCB constraints for IoT designs

An RF Laboratories engineer provides some tips and techniques in the context of the PADS Professional suite.
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July 31, 2020

Open-RAN puts more focus on emulation in testing programs

Recent developments have made Open-RAN look more attractive as a way of implementing 5G systems. This is helping to drive a shift-left in verification and test.
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June 18, 2020

Kioxia looks to waferscale flash drives for fast, low-cost storage

Waferscale SSDs are among the future drive architectures being explored by Kioxia, according to a keynote delivered at VLSI Symposia.
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May 15, 2020

Coronavirus Resources: Mentor

Live and on-demand videos as well as You Tube 'tips and techniques' clips form part of a wide 'work at home' support package from Mentor.
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April 14, 2020

Coronavirus Resources: Zuken

The PCB and wire harness design specialist has posted an online blog with tips and advice on using and licensing its tools for home use.
January 7, 2020

Siemens and Arm combine to extend digital twin further into SoC design

Partnership combines Siemens PAVE 360 digital twin with ARM IP, including dedicated automotive offerings, to speed and streamline design toward Level 5.
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December 18, 2019

Capacitive link to power cheap wireless tags

Imec, TNO, and Cartamundi have developed a low-cost way of letting tags communicate with embedded devices wirelessly by using a capacitive touchscreen.
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December 4, 2019

Cadence to acquire AWR from National Instruments

Cadence Design Systems has agreed to buy the AWR RF-design company from its current owner National Instruments for approximately $160m.
September 23, 2019

Automating wire-harness development

Harness manufacture in automotive remains manually intensive but model-based engineering provides a way to streamline the processes to make them more efficient, a Mentor white paper claims.
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September 18, 2019

Cadence expands system analysis to thermal

Cadence has followed its launched of a parallelizable EM simulator with one that focuses on the thermal behavior of ICs through to multi-PCB assemblies.
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