Backside metal defends against IR drop and side-channel attacks
Work presented at IEDM 2020 shows taking advantage of the IC backside for power and ground for the additional area can deliver further benefits for IR drop and security.
power grid
Transistor stacks piled high at VLSI
As 2D scaling becomes increasingly difficult, researchers reporting at VLSI Symposia have focused attention on what can be done in the third dimensions to improve density and performance without a sudden break from conventional CMOS processes.
Overcoming electromigration analysis limitations for larger on-die power grids
Award-winning paper describes new strategy offering both greater speed and accuracy.
ARM tools take aim at finFET layout, timing issues
ARM has launched a pair of tools designed to improve the density and performance of finFET designs that use the company's physical libraries.
Cadence ties IR drop into static timing analysis
Cadence Design Systems uses parallelism in its Voltus tool to provide faster IR drop analysis and bridge static timing and IC-level power-integrity analysis.
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