IMEC

December 9, 2022

Imec adds MOL layer to potentially cut cell size 20%

Adding an MOL layer that takes advantage of a self-aligned pitch-splitting technique and a rotated layout could cut standard-cell height to 4T.
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December 5, 2022

Imec pushes endurance on ferro memory at IEDM

Imec has developed a high-endurance ferroelectric capacitor that could form the basis of storag-class embedded and standalone memories.
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October 17, 2022

2D advances to take center stage at IEDM

At IEDM, TSMC is at the top of several papers that examine how 2D materials might be put into action as successors to silicon, alongside work from a variety of institutions on power integration and thermal management.
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June 1, 2022

Oxide DRAM gains traction at VLSI Symposium

VLSI Symposium 2022 will show the rapid development taking place in oxide-based replacements for traditional DRAM cells as well as the emerging area of memory-based low-power machine learning.
October 18, 2021

Three ways to 3D feature at IEDM

Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.
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June 15, 2021

Imec cuts transistor gap to less than 20nm with forksheets

Imec showed at VLSI Symposia a process flow that can cut the gap between complementary transistors to less than 20nm.
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May 2, 2021

Alternative scaling approaches form VLSI 2021 technology highlights

The upcoming VLSI Symposia will feature a number of papers that show the ways in which novel approaches are going to be needed to continue scaling.
January 15, 2021

Copper’s future is troubled but it’s likely to stick around

The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.
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December 15, 2020

Chipmaking’s new environment presented at IEDM

Imec's senior vice president of CMOS outlined future directions for the technology over the coming decade.
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November 9, 2020

IEDM 2020 highlights transistor and interconnect advances

This year's IEDM will feature papers that exploit stacked nanoribbons to reduce CMOS footprint, graphene interconnects that support easier integration, and the variability prospects of 2D semiconductors.
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