IMEC

October 14, 2019

Integration forms highlights of upcoming IEDM

Different forms of heterogeneous integration take center stage at the IEEE International Electron Device Meeting (IEDM) in December this year.
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July 2, 2019

The road to ES Design West: Location, location, location

There's still plenty of time to build a busy and profitable agenda for a visit to ES Design West and SEMICON West in San Francisco next week.
December 12, 2018

IEDM shows progress on embedded eMRAM

Embedded magnetic RAM is emerging as a contender for on-chip memory not just from a density standpoint but from that of power.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations: , , ,
October 22, 2018

IEDM to examine scaling from multiple directions

CMOS moving to 3nm and DRAM going beyond 20nm scaling are two of the late papers at the upcoming IEDM and part of a larger examination of semiconductor trends.
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June 22, 2018

Imec stacks transistors for denser 3nm option

Imec proposes using stacked CMOS transistors and buried power rails to improve density for the 3nm process node.
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June 18, 2018

Switch to orbit mode boosts MRAM on 300mm wafers

Imec will at this week’s VLSI Symposia describe how it fabricated a form of magnetic memory suitable for use as a non-volatile cache onto 300mm wafers using CMOS-compatible processes.
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May 23, 2018

Pillar transistor points to smaller SRAMs at 5nm

Imec and Unisantis Electronics have developed a process flow based on a vertical transistor with a gate on all sides they claim will lead to denser memories on a 5nm node.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations:
May 11, 2018

Mixed-signal circuits push scaled CMOS at VLSI

The circuits sessions at mid-June's VLSI Symposia in Honolulu feature a number of papers that improve the performance of scaled mixed-signal processes.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: , ,
May 4, 2018

7nm process with EUV to feature at VLSI

Samsung Electronics will describe at the upcoming VLSI Symposia how its engineers have applied EUV to a variety of layers in a 7nm finFET process.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , , ,
February 28, 2018

Cadence and Imec tape out 3nm interconnect test chip

Cadence and Imec have worked together on a project to tape out a test chip to explore manufacturing and design-rule options for the interconnect on future 3nm processes.

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