Stanford University


July 21, 2020

3D integration technologies will blend says TSMC chief scientist

DTCO and 3D integration will dominate scaling in the coming decade, TSMC chief scientist Philip Wong claimed in his keynote at DAC on Monday
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: ,
June 21, 2018

AI is all about low-energy hardware says Dally

For nVidia chief scientist and Stanford professor Bill Dally, now is a great time to be involved in hardware design, thanks to the rise of AI.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , , , ,   |  Organizations: ,
June 8, 2016

Minimize memory moves for greener data centers

Deep pipelines and dynamic memory sharing may provide the key to the development of faster and more efficient server-farm blades as the focus in hardware design moves to augmenting conventional processors with specialized accelerators.
March 12, 2013

EDA sets sail in a ‘sea of processors’

The purchase of Tensilica by Cadence Design Systems could prove the way that EDA and multicore-based system design come together.

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