October 17, 2022
At IEDM, TSMC is at the top of several papers that examine how 2D materials might be put into action as successors to silicon, alongside work from a variety of institutions on power integration and thermal management.
June 14, 2021
At the VLSI Symposia, researchers described how AI hardware could help dramatically accelerate analog and digital design and not all of it directly through machine learning.
July 21, 2020
DTCO and 3D integration will dominate scaling in the coming decade, TSMC chief scientist Philip Wong claimed in his keynote at DAC on Monday
June 21, 2018
For nVidia chief scientist and Stanford professor Bill Dally, now is a great time to be involved in hardware design, thanks to the rise of AI.
June 8, 2016
Deep pipelines and dynamic memory sharing may provide the key to the development of faster and more efficient server-farm blades as the focus in hardware design moves to augmenting conventional processors with specialized accelerators.
March 12, 2013
The purchase of Tensilica by Cadence Design Systems could prove the way that EDA and multicore-based system design come together.