This year’s IEDM features a number of papers that seek to drive down the size and boost the performance of image sensors.
Silicon Photonics 3D integration posed LVS challenges in this fast emerging technical space. A case study describes how the two institutions overcame them.
Work by the University of Toronto and Arm presented at IEDM indicates plasmonics could be a viable contender for high-speed chip-chip communications.
Different forms of heterogeneous integration take center stage at the IEEE International Electron Device Meeting (IEDM) in December this year.
The ODSA Workgroup formed by Netronome and others is looking to adopt the PIPE standard for interconnecting chiplets as it starts work on a proof-of-concept module.
MACOM has decided to use GlobalFoundries' 90nm SOI process on 300mm wafers to build higher-integration optical-switching devices for servers.
It's been a long time coming, but silicon photonics is now entering commercial design for networking and grabbing attention in autonomous driving and sensors.
The LightSuite Compiler produces designs based on Python descriptions and certifies them DRC-clean through hooks into the market-leading Calibre DFM suite.
The major West Coast technical conference for lithography is just two weeks away and offers a packed agenda.
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