Researchers at the Georgia Institute of Technology adapted conventional 2D layout tools to a two-layer monolithic 3D process that resulted in sizeable space and power savings.
Deep pipelines and dynamic memory sharing may provide the key to the development of faster and more efficient server-farm blades as the focus in hardware design moves to augmenting conventional processors with specialized accelerators.
But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.
Open-source hardware, in-field configurability, and a hardware-plus-services approach could protect margins as the IoT hammers down costs, says GSA report.
Researchers describe at IEDM 2015 how they are making gallium nitride fit into a wider range of power-handling applications and may even result in mass-market vertical transistors.
Simulation shows 7nm process will need tighter variability control than expected, and possibly accommodation for asymmetric variability
But the bridge standard's European backers still need greater support from the big EDA vendors.
IMEC and Cadence have taped out a test chip intended to explore key lithography and metal-interconnect issues that will face users of the forthcoming 5nm process node.
IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
Is the industry ready to go beyond 10nm when it comes to lithography? Lithography researcher Professor David Pan sees design and process co-operation as the key approach.
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