Research Groups

At IEDM, TSMC is at the top of several papers that examine how 2D materials might be put into action as successors to silicon, alongside work from a variety of institutions on power integration and thermal management.

As the project that funded OpenRoad draws to a close, experts pondered its wider future at the 59th DAC.

VLSI Symposium 2022 will show the rapid development taking place in oxide-based replacements for traditional DRAM cells as well as the emerging area of memory-based low-power machine learning.

Silicon Photonics 3D integration posed LVS challenges in this fast emerging technical space. A case study describes how the two institutions overcame them.

Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.

Siemens EDA has become the first of the major EDA vendors to join the DARPA Toolbox Initiative.

Imec showed at VLSI Symposia a process flow that can cut the gap between complementary transistors to less than 20nm.

At the VLSI Symposia, researchers described how AI hardware could help dramatically accelerate analog and digital design and not all of it directly through machine learning.

The upcoming VLSI Symposia will feature a number of papers that show the ways in which novel approaches are going to be needed to continue scaling.

The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.