Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.
DAC 2021 is looming and here is our first round up of a major EDA player's plans for the physical event in San Francisco.
Packetized test and three new technologies provide the core of the company's DFT presentations during the virtual International Test Conference running this week.
The free-to-attend user meetings for Mentor clients will retain the same format mixing technical presentations with keynotes and networking.
Even experienced IC design houses must adopt innovative and emerging strategies to meet functional safety and other demands of ISO 26262 for automotive systems.
View All Sponsors