Applied Materials and CEA-Leti have expanded their collaboration with the creation of a joint lab to develop materials useful for sensors, RF communications, and power devices, and with a focus on heterogeneous integration.
Siemens has made its PAVE360 automotive digital-twin software available on AWS, with the ability to access fast Arm models on the same cloud.
X-Fab has made it possible to put galvanic isolation based on capacitive coupling directly into chips made on its XA035 process.
X-Fab Silicon Foundries claims to be the first with a foundry offering for 110nm BCD-on-SOI technology, aimed primarily at automotive designers.
The company says the mixed-signal platform enabled a 5X improvement in verification productivity.
DVCon Europe's keynotes will examine verification issues in connected cars and 5G networks.
A new white paper examines how to develop architectures around the main E/E elements placing growing demands on automotive engineering teams.
A Siemens Tessent white papers examines the role of safety islands in advanced automotive systems.
The need for the electrical and mechanical design domains to inform one another in more detail is recognized, but how do you do it?
STMicroelectronics has made its first silicon carbide wafers that can be run on a 200mm line.
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