A Siemens Tessent white papers examines the role of safety islands in advanced automotive systems.
The need for the electrical and mechanical design domains to inform one another in more detail is recognized, but how do you do it?
STMicroelectronics has made its first silicon carbide wafers that can be run on a 200mm line.
TSMC is developing processes for high-end automotive and RF based off its N5 and N7 families.
The formal apps start-up has built strong positions in automotive and RISC-V and will strengthen Siemens in competition with Cadence.
Yokogawa's development of a data-recording oscilloscope is built around the ability to connect instruments together and synchronize their measurements.
Use of the open-source RISC-V processor was tracked for the first time by the biennial study, finding notably high take-up.
Mentor is packaging a range of software IP, reference designs, and technical help as VCO2S, for Vehicle Cockpit Consolidation Solutions.
A partnership between Siemens and VSI, a real-world autonomous vehicle research company, aims to refine and promote digital twin strategies.
Among the papers that will be presented at the end of October, this year's DVCon Europe will demonstrate the benefits of taking good ideas from wherever you can in the pursuit of more effective verification flows.
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