automotive

Certification to ISO 26262 for automotive systems and compatibility with the latest Arm9 generation of processors and the CHI-E interface are among the updates to Arteris’ Ncore cache-coherent on-chip network IP framework.

Arm is working with Cadence and Siemens on separate projects to support its plans in the SDV space.

Applied Materials and CEA-Leti have expanded their collaboration with the creation of a joint lab to develop materials useful for sensors, RF communications, and power devices, and with a focus on heterogeneous integration.

Siemens has made its PAVE360 automotive digital-twin software available on AWS, with the ability to access fast Arm models on the same cloud.

X-Fab has made it possible to put galvanic isolation based on capacitive coupling directly into chips made on its XA035 process.

X-Fab Silicon Foundries claims to be the first with a foundry offering for 110nm BCD-on-SOI technology, aimed primarily at automotive designers.

The company says the mixed-signal platform enabled a 5X improvement in verification productivity.

DVCon Europe's keynotes will examine verification issues in connected cars and 5G networks.

A new white paper examines how to develop architectures around the main E/E elements placing growing demands on automotive engineering teams.

A Siemens Tessent white papers examines the role of safety islands in advanced automotive systems.