Research Groups

November 20, 2013

FinFETs’ III-V future promises sub-7nm, RF and opto CMOS

FinFETs for 7nm and below processes will be able to integrate high-mobility III-V materials despite being built on silicon processes, thanks to recent work by imec.
Article  |  Topics: Design to Silicon, Blog - EDA  |  Tags: ,   |  Organizations:
October 4, 2013

Design kit for 10nm FD-SOI due out next year

Research group CEA-Leti expects to have design kits ready for a 10nm FD-SOI process in June 2014
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: ,
June 3, 2013

CMOS “good for another century,” says father of finFET

CMOS approaches are likely to underpin electronics for the next century, according to Chenming Hu, father of the finFET
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations:
April 10, 2013

3D-IC cooling ascends the agenda

US defense research agency DARPA sets targets for cooling overall systems and hot spots in stacked silicon, and backs joint research from Rockwell-Collins and Georgia Tech.
Article  |  Topics: Design to Silicon, Blog - EDA  |  Tags: ,   |  Organizations: , ,
March 27, 2013

Intel and ST stake claims to foundry low power designs

With both now more dependent on foundry business for their finFET (trigate) and FDSOI offerings, DATE was a chance to push their innovations in low power.
March 22, 2013

DATE: Silicon Europe plans to build cluster of clusters

Four of the European centers for electronics research and business development have set up a project to try to create a virtual “silicon cluster” that aims ultimately to build a worldwide development network for energy-efficient systems.
Article  |  Topics: Blog - Embedded  |  Tags: , , , ,   |  Organizations: ,
March 19, 2013

FD-SOI costs to match bulk by year end, says ST

STMicroelectronics pushes on with FDSOI despite dissolution of ST-Ericcson joint venture that provided the lead customer for the process.
Article  |  Topics: Blog Topics, Conferences  |  Tags: , , , , , ,   |  Organizations: ,
March 12, 2013

EDA sets sail in a ‘sea of processors’

The purchase of Tensilica by Cadence Design Systems could prove the way that EDA and multicore-based system design come together.
February 19, 2013

ISSCC 2013: Energy harvesting needs to prioritize

ISSCC expert panel highlights lowering power over energy sources and identifies the need to focus on the product rather than the technology
Article  |  Topics: Blog Topics, Blog - EDA, Embedded  |  Tags: , ,   |  Organizations:
December 11, 2012

FD-SOI vs finFETs mulled during IEDM

Can planar devices on fully depleted SOI resist the relentless rise of finFETs as the next device architecture of choice for the semiconductor industry? An evening panel at IEDM explored the trade-offs

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