3DIC

Alphawave Semi has collaborated with Arm on the development of an advanced compute chiplet based on Arm’s Neoverse compute subsystems.

Imec has developed cleaner techniques for preparing die-to-wafer bonding components for high-density logic-memory stacks and optical integration.

This year’s ECTC, held at the end of May, will continue its focus on the role of packaging in keeping silicon scaling on track.

Cadence has introduced a platform for performing thermal and thermal-stress analysis of subsystems, from 2.5D and 3DICs to PCBs and complete electronic assemblies.

Shifting to low-carbon generation for electricity would do much to cut the carbon footprint of semiconductor processes according to work shown at this year’s IEDM.

South Korea's leading research institute has built a reusable flow for lower power petaflops-performance AI.

This year’s IEDM features a number of papers that seek to drive down the size and boost the performance of image sensors.

The IEEE Symposium on VLSI Technology & Circuits switches back to Honolulu for its 44th year in the summer of next year and has issued its call for papers, with a deadline of early February for contributions.

Chiplet-based 3DIC designs present new challenges for flows that integrate tasks from design exploration to physical verification.

The choices for heterogeneous integration are falling into three main families, demonstrated by A*Star at IEDM 2022.