3DIC

A Siemens white paper describes a way of automatically deriving information from 2.5D/3DIC designs to streamline latchup design-rules verification.

The added complexity of managing reliability as chiplet-based designs become more common will need to be managed using digital-twin techniques, says a professor working in the field.

IEDM has issued a call for papers for what the organizers expect to be an in-person event in December.

TSMC is using its growing experience with EUV lithography to fill in sub-nodes between its major releases as it prepares to extend finFET technology to the forthcoming N3 process.

DTCO and 3D integration will dominate scaling in the coming decade, TSMC chief scientist Philip Wong claimed in his keynote at DAC on Monday

Heterogeneous integration has the potential to overcome the yield and cost challenges presented by the growing headwinds associated with process scaling. But it may take a dramatic rethink in design approaches.

Synopsys is taking IC design on TSMC processes into the cloud with the launch of the Synopsys Cloud Solution, which will run on platforms from Synopsys, Amazon Web Services (AWS) or Microsoft Azure.

Research institute Leti and Soitec have decided to team up to work on a new generation of engineered substrates, such as specialized SOI wafers.

IEDM has issued a call for papers for its 2018 conference, expecting to cover devices and circuit interactions in neuromorphic, quantum and conventional computing.

Cadence Design Systems has made enhancements to its Virtuoso mixed-signal layout tool at both the system-level and nanometer-design levels for its 18.1 release.