3DIC

The choices for heterogeneous integration are falling into three main families, demonstrated by A*Star at IEDM 2022.

TSMC calls for modular EDA flows and increased use of hierarchical verification to support complex 3DIC designs.

Nvidia says it will support the UCIe chiplet interface standard once it has "stabilized" while opening up its latest form of NVLink to other companies.

At December's Design Automation Conference, AMD senior vice president Sam Naffziger provided more insights into the chipmaker’s use of chiplet-based design and manufacture.

Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.

Cadence has built a unified database to support a group of tools to support the planning and implementation of 3DIC designs.

A Siemens white paper describes a way of automatically deriving information from 2.5D/3DIC designs to streamline latchup design-rules verification.

The added complexity of managing reliability as chiplet-based designs become more common will need to be managed using digital-twin techniques, says a professor working in the field.

IEDM has issued a call for papers for what the organizers expect to be an in-person event in December.

TSMC is using its growing experience with EUV lithography to fill in sub-nodes between its major releases as it prepares to extend finFET technology to the forthcoming N3 process.