3DIC

TSMC is using its growing experience with EUV lithography to fill in sub-nodes between its major releases as it prepares to extend finFET technology to the forthcoming N3 process.

DTCO and 3D integration will dominate scaling in the coming decade, TSMC chief scientist Philip Wong claimed in his keynote at DAC on Monday

Heterogeneous integration has the potential to overcome the yield and cost challenges presented by the growing headwinds associated with process scaling. But it may take a dramatic rethink in design approaches.

Synopsys is taking IC design on TSMC processes into the cloud with the launch of the Synopsys Cloud Solution, which will run on platforms from Synopsys, Amazon Web Services (AWS) or Microsoft Azure.

Research institute Leti and Soitec have decided to team up to work on a new generation of engineered substrates, such as specialized SOI wafers.

IEDM has issued a call for papers for its 2018 conference, expecting to cover devices and circuit interactions in neuromorphic, quantum and conventional computing.

Cadence Design Systems has made enhancements to its Virtuoso mixed-signal layout tool at both the system-level and nanometer-design levels for its 18.1 release.

Intel and GlobalFoundries will talk about their post-14nm finFET-based processes at December's IEDM.

TSMC encapsulated the multiple chips assembled on a 1200mm2 silicon substrate to cut the chance of damage from warping with the company's CoWoS2 SiP technology.

Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.