Tech Design Forum Briefing


Briefing Authors

Paul Dempsey

Paul Dempsey Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.

Luke Collins

Luke Collins Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.

Chris Edwards

Chris Edwards Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
November 23, 2022

Chipletz pushes packaging design for AI, HPC and immersive use-cases

The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.

November 21, 2022

DVCon Europe looks to network effects

Aside from the keynotes and technical papers, the networking at an event like DVCon Europe provides a way to keep open-source EDA on the road.

November 15, 2022

Real Intent tool looks for glitches

Real Intent has developed a tool to check design and the potential for circuits to glitch.

November 14, 2022

Semiwise brings cryogenic models to SOI

Semiwise has developed transistor models for the GlobalFoundries 22FDX that cover operation at cryogenic temperatures.

October 25, 2022

DVCon Europe keynotes focus on connectivity

DVCon Europe’s keynotes will examine verification issues in connected cars and 5G networks.

October 17, 2022

2D advances to take center stage at IEDM

At IEDM, TSMC is at the top of several papers that examine how 2D materials might be put into action as successors to silicon, alongside work from a variety of institutions on power integration and thermal management.

October 6, 2022

Arm adds Corellium expertise for IoT to its Virtual Hardware platform

The start-ups virtualization platform has already been gaining traction in comms and security.

September 27, 2022

Siemens automates test to handle multi-die 2.5D, 3D and 5.5D architectures

Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.

September 21, 2022

Nvidia proposes split-level link for chiplet interconnect

Nvidia revealed at its Fall GTC work the company has done on a bidirectional energy-saving chiplet interconnect that could hit the equivalent of 50Gbit/s per line.

September 21, 2022

Agile Analog adds digital library for easier porting

Agile Analog has launched its own digital standard cell library, designed to be used in the control circuits for analog blocks that form the IP company’s main offering.

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