BCI-ROM: a game-changer for electro-thermal design
The Boundary Condition Independent Reduced Order Model (BCI-ROM) provides vital help in addressing growing electro-thermal challenges in SPICE simulation.
IC Implementation
Improved power management and faster time to market?
We have the technology. Learn how to 'shift left' with Calibre DesignEnhancer and meet IR, EM and PPA objectives.
Welcome to the part model era
Standards-based digital threads will revolutionize design through part models that deliver trust, traceability and context across components.
How to migrate SoC design to the cloud
Moving part of all of a design flow to the cloud involves careful preparation and evaluation as there is no 'one-size-fits-all'.
Give the people what they want: toward making 3D IC mainstream
Learn more about the five interconnected workflows that are democratizing next generation design in the emerging chiplet age.
Putting it all together to accelerate 3D IC design
Learn how connectivity management solutions help you manage the multiple formats in which 3D IC components are delivered.
NVMe-oF – The future of cloud storage
NVMe over Fabrics (NVMe-oF) extends the memory standard for burgeoning data traffic and the demands of AI and machine learning.
Layout customization improves productivity in design and verification flows
What are the options and how do you balance overarching CAD requirements and personal preferences?
Executable specifications boost SoC and IP efficiency
Automating executable specifications as they evolve can deliver major efficiencies.
Use digitalization to mitigate the automotive MCU shortage
The Covid-driven MCU shortage for ECUs and elsewhere in vehicle design can bring entire production lines to a halt if not properly managed.