IC Implementation

November 30, 2023
BCI-ROM feature

BCI-ROM: a game-changer for electro-thermal design

The Boundary Condition Independent Reduced Order Model (BCI-ROM) provides vital help in addressing growing electro-thermal challenges in SPICE simulation.
August 8, 2023
Jeff Wilson is a Product Management Director for DFM applications in the Calibre Design solutions organization at Siemens Digital Industries Software. Before joining Siemens, Jeff worked at Motorola and SCS. He holds a B.Sc. in design engineering from Brigham Young University and an MBA from the University of Oregon.

Improved power management and faster time to market?

We have the technology. Learn how to 'shift left' with Calibre DesignEnhancer and meet IR, EM and PPA objectives.
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April 24, 2023
Matthew Welsh, Siemens DIS

Welcome to the part model era

Standards-based digital threads will revolutionize design through part models that deliver trust, traceability and context across components.
February 8, 2023
Nebabie Kebebew is a senior product manager at Siemens EDA.

How to migrate SoC design to the cloud

Moving part of all of a design flow to the cloud involves careful preparation and evaluation as there is no 'one-size-fits-all'.
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January 26, 2023
3D IC workflow democratization

Give the people what they want: toward making 3D IC mainstream

Learn more about the five interconnected workflows that are democratizing next generation design in the emerging chiplet age.
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January 19, 2023
Connectivity Management Feature - Jan 23

Putting it all together to accelerate 3D IC design

Learn how connectivity management solutions help you manage the multiple formats in which 3D IC components are delivered.
September 7, 2022

NVMe-oF – The future of cloud storage

NVMe over Fabrics (NVMe-oF) extends the memory standard for burgeoning data traffic and the demands of AI and machine learning.
April 28, 2022
James Paris is a senior product engineer with the Design to Silicon division of Siemens Digital Industries Software, supporting Calibre design interfaces. Prior to joining Siemens, he held roles in analog/mixed-signal physical design implementation and flow development for various IC design companies. James holds a BS in Computer-Aided Design Engineering and an MBA in Marketing.

Layout customization improves productivity in design and verification flows

What are the options and how do you balance overarching CAD requirements and personal preferences?
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March 21, 2022
Tom Anderson is a technical marketing consultant working with multiple EDA vendors, including AMIQ EDA. His previous roles have included vice president of marketing at Breker Verification Systems, vice president of applications engineering at 0-In Design Automation, vice president of engineering at IP pioneer Virtual Chips, group director of product management at Cadence, and director of technical marketing at Synopsys. He holds a Master of Science degree in Computer Science and Electrical Engineering from M.I.T. and a Bachelor of Science degree in Computer Systems Engineering from the University of Massachusetts at Amherst.

Executable specifications boost SoC and IP efficiency

Automating executable specifications as they evolve can deliver major efficiencies.
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March 8, 2022
Brendan Morris is a senior technical marketing manager for the Integrated Electrical Systems group, Siemens Digital Industries Software. He spent his early career working in Automotive Tier 1 suppliers, working on a diverse range of technologies and vehicle types, including software development in powertrain electronics. He spent the next 10 years working for several vehicle OEM's at all stages of vehicle development programs. Brendan holds an M.Eng degree in Automotive Engineering from Loughborough University.

Use digitalization to mitigate the automotive MCU shortage

The Covid-driven MCU shortage for ECUs and elsewhere in vehicle design can bring entire production lines to a halt if not properly managed.
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