The two best papers at the recent DVCon Europe underlined two of the issues that now face chip-implementation teams: efficient flows and reliability.
Shifting to low-carbon generation for electricity would do much to cut the carbon footprint of semiconductor processes according to work shown at this year’s IEDM.
Applied Materials and CEA-Leti have expanded their collaboration with the creation of a joint lab to develop materials useful for sensors, RF communications, and power devices, and with a focus on heterogeneous integration.
EMA Design Automation to launch sister company, Accelerated Designs, to help clients streamline processes, cut manual effort, and connect data.
Arm has added machine-learning extensions and pointer-security instructions to its latest Cortex-M series core.
Imec has a version of its imec.netzero virtual fab tool accessible to the general public with the aim of showing the environmental impact of IC manufacturing.
Codasip has put support for a set of instruction extensions intended to secure memory into its RISC-V core designs.
X-Fab has made it possible to put galvanic isolation based on capacitive coupling directly into chips made on its XA035 process.
SureCore and Intrinsic have teamed up to provide a way to implement resistive random-access memory as an SoC-embeddable technology.
Accellera has published for public review version 0.1 of a standard designed to help pass clock-domain crossing information between EDA tools.
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