June 6, 2024

Alphawave incorporates Neoverse into chiplet clusters

Alphawave Semi has collaborated with Arm on the development of an advanced compute chiplet based on Arm’s Neoverse compute subsystems.
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May 29, 2024

Imec cleans up process for 2µm-pitch 3DIC stacks

Imec has developed cleaner techniques for preparing die-to-wafer bonding components for high-density logic-memory stacks and optical integration.
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May 2, 2024

VLSI to explore vertical device changes and 3nm finFET

The upcoming VLSI Symposium will examine progress in using backside contacts and 3D structures to improve density and speed as well as continuing improvements to finFET processes.
April 9, 2024

Arm embraces Transformers with faster NPU

Arm has launched what the company claims is its highest-performance and most-efficient AI accelerator.
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March 18, 2024

Arteris extends safety and speed for NoC

Certification to ISO 26262 for automotive systems and compatibility with the latest Arm9 generation of processors and the CHI-E interface are among the updates to Arteris’ Ncore cache-coherent on-chip network IP framework.
March 14, 2024

Two projects to deliver digital twins for software-defined vehicles

Arm is working with Cadence and Siemens on separate projects to support its plans in the SDV space.
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February 22, 2024

Cadence to work on IP for Intel 18A

Cadence has agreed to work with Intel Foundry Services on IP and flows for the 18A process, which will include backside power delivery and nanosheet transistors.
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December 27, 2023

Flow stability and chip reliability top the papers at DVCon Europe

The two best papers at the recent DVCon Europe underlined two of the issues that now face chip-implementation teams: efficient flows and reliability.
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December 22, 2023

Sustainability work puts numbers on chipmaking production at IEDM

Shifting to low-carbon generation for electricity would do much to cut the carbon footprint of semiconductor processes according to work shown at this year’s IEDM.
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December 6, 2023

Applied and CEA-Leti team up for novel materials R&D

Applied Materials and CEA-Leti have expanded their collaboration with the creation of a joint lab to develop materials useful for sensors, RF communications, and power devices, and with a focus on heterogeneous integration.
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