Blog Topics

July 8, 2020

Arm returns to its roots

Arm is to return to focusing on semiconductor IP following the decision to spin out its IoT operations to separate groups within the Softbank empire.
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July 7, 2020

DVCon Europe goes virtual

The organizers of DVCon Europe have decided to turn the autumn verification conference into a virtual event this year.
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July 1, 2020

Sigasi creates SDK for custom editors

Sigasi has launched a software kit to provide inhouse tools builders and EDA vendors with a way to build in code-editing features.
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June 24, 2020

IEDM switches to virtual format for 2020

The organizers of the 66th annual IEDM have decided to hold the December conference virtually.
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June 23, 2020

Mentor to use UltraSoC acquisition to drive in-life learning

Siemens has agreed to acquire UK-based debug and on-chip instrumentation startup UltraSoC and will fold the operation into Mentor’s Tessent test-software product line.
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June 23, 2020

How to draw upon Mentor-Microsoft integration for embedded IoT

The combination of Embedded Linux and Azure is supported by services and technologies that speed the delivery and deployment of MCU-based projects.
June 18, 2020

Kioxia looks to waferscale flash drives for fast, low-cost storage

Waferscale SSDs are among the future drive architectures being explored by Kioxia, according to a keynote delivered at VLSI Symposia.
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June 18, 2020

How Ambarella met the demands of automotive DFT

Even experienced IC design houses must adopt innovative and emerging strategies to meet functional safety and other demands of ISO 26262 for automotive systems.
June 17, 2020

Siemens raises Capital to full E/E design level

Capital has been grown from a wire harness suite to a full electrical/electronic platform with integration for digital twin strategies.
June 16, 2020

Transistor stacks piled high at VLSI

As 2D scaling becomes increasingly difficult, researchers reporting at VLSI Symposia have focused attention on what can be done in the third dimensions to improve density and performance without a sudden break from conventional CMOS processes.

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