Following its rebranding from Mentor, the division will have a strong presence in the main program and across virtual roundtables at next week's online event.
Both Semicon West and DAC have been moved to December in anticipation of travel restrictions being much looser by then, with both events working on a hybrid physical and online format.
A new white paper reviews the history of the open-source platform and provides guidance on best practice development for embedded.
Yokogawa's development of a data-recording oscilloscope is built around the ability to connect instruments together and synchronize their measurements.
Pulsic has adopted the freemium approach with a tool that gives designers of analog circuits previews of how they will be implemented on-chip.
Virtual strategies make for greater productivity and widen the number of emulation use cases. A new paper considers some of the most popular examples.
Design-services company Sondrel is recommending teams start earlier on package design to avoid delays after IC tapeout.
The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.
Work by the University of Toronto and Arm presented at IEDM indicates plasmonics could be a viable contender for high-speed chip-chip communications.
Work presented at IEDM 2020 shows taking advantage of the IC backside for power and ground for the additional area can deliver further benefits for IR drop and security.
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