Blog Topics

November 19, 2019

2020 VLSI Symposia to look at the next 40 years

Having provided a forum for describing the progress of process technology and circuit design for four decades, the organizers of the 2020 Symposia on VLSI Technology & Circuits are asking presenters to look at the coming 40 years.
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November 12, 2019

Mentor cuts scan time in package of test measures for automotive designs

Aimed at automotive designs, Mentor has developed a BIST technology that the company claims can speed up the process ten-fold by making more of each scan cycle.
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November 12, 2019

Xilinx aims for software flow with Vitis

Xilinx has released the first version of its Vitis development environment as the company aims to capture a user base that is more used to software than hardware tools.
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November 11, 2019

Mentor takes DFT planning to a higher level for hierarchical flows

Mentor has introduced a DFT-automation methodology that is designed to support the growing use of hierarchical strategies.
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November 8, 2019

Accellera sets up to group to look at interoperability for safety analysis

Accellera to look at interoperability standard for failure analysis tools in safety engineering.
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October 29, 2019

Mentor scales AMS cloud verification to 10,000 cores

Tests on Microsoft Azure's cloud have shown Mentor's AMS simulation tools can run across thousands of processors with near-linear scaling.
October 29, 2019

Circuit analysis speed up radiation checks for automotive SoCs

Optima DA has launched a family of tools designed to speed up the analysis of radiation susceptibility in automotive SoC designs.
October 29, 2019

Foundries call off patent war

GlobalFoundries and TSMC have called off their legal battle with a wide-ranging patent cross-licensing deal.
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October 22, 2019

Semicon Europa adds design and smart-transportation seminars

The ESD Alliance is adding design and transportation-systems streams to the Semicon Europa 2019 show.
October 14, 2019

Integration forms highlights of upcoming IEDM

Different forms of heterogeneous integration take center stage at the IEEE International Electron Device Meeting (IEDM) in December this year.
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