Blog Topics

February 26, 2021

Embeddedworld 2021 Digital preview: Siemens EDA

Following its rebranding from Mentor, the division will have a strong presence in the main program and across virtual roundtables at next week's online event.
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February 17, 2021

DAC and Semicon West move to December

Both Semicon West and DAC have been moved to December in anticipation of travel restrictions being much looser by then, with both events working on a hybrid physical and online format.
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February 15, 2021

Getting a RISC-V embedded toolchain in place

A new white paper reviews the history of the open-source platform and provides guidance on best practice development for embedded.
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February 10, 2021

Instrument sync underpins scopecorder development

Yokogawa's development of a data-recording oscilloscope is built around the ability to connect instruments together and synchronize their measurements.
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February 4, 2021

Pulsic goes freemium with analog-preview tool

Pulsic has adopted the freemium approach with a tool that gives designers of analog circuits previews of how they will be implemented on-chip.
January 22, 2021

How to use virtual mode in emulation

Virtual strategies make for greater productivity and widen the number of emulation use cases. A new paper considers some of the most popular examples.
January 19, 2021

Design house recommends earlier start to flip-chip bump layout

Design-services company Sondrel is recommending teams start earlier on package design to avoid delays after IC tapeout.
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January 15, 2021

Copper’s future is troubled but it’s likely to stick around

The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.
December 21, 2020

Plasmonics may point way to faster interchip comms

Work by the University of Toronto and Arm presented at IEDM indicates plasmonics could be a viable contender for high-speed chip-chip communications.
December 18, 2020

Backside metal defends against IR drop and side-channel attacks

Work presented at IEDM 2020 shows taking advantage of the IC backside for power and ground for the additional area can deliver further benefits for IR drop and security.

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