Blog Topics

May 13, 2024

Dense packaging focus for ECTC

This year’s ECTC, held at the end of May, will continue its focus on the role of packaging in keeping silicon scaling on track.
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May 2, 2024

VLSI to explore vertical device changes and 3nm finFET

The upcoming VLSI Symposium will examine progress in using backside contacts and 3D structures to improve density and speed as well as continuing improvements to finFET processes.
April 29, 2024

Abaco adopts Covid-19 lessons for HPC design

Mil/aero specialist Abaco Systems refined its workflow across multiple design sites after the pandemic constrained collaboration.
April 29, 2024

Beyond manual PCB routing

PCB routing is best served by a mixture of manual and automated tasks. A new e-book describes the boundaries between the two.
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April 15, 2024

Rigid-flex: get the book for an inside view

The technique is becoming increasingly important for designs that need to be flexible, compact and lightweight.
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April 11, 2024

Early package assembly verification for faster, better results

Make it easier to capture issues in 2.5D and 3D designs with multiple chiplets and emerging challenges with this 'shift left' approach.
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April 9, 2024

Arm embraces Transformers with faster NPU

Arm has launched what the company claims is its highest-performance and most-efficient AI accelerator.
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March 29, 2024

Get a comprehensive overview of ‘Shift Left’ for physical verification

How the various features within today's Calibre physical verification family help designers shift left tasks and cut time-to-market.
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March 18, 2024

Arteris extends safety and speed for NoC

Certification to ISO 26262 for automotive systems and compatibility with the latest Arm9 generation of processors and the CHI-E interface are among the updates to Arteris’ Ncore cache-coherent on-chip network IP framework.
March 14, 2024

Two projects to deliver digital twins for software-defined vehicles

Arm is working with Cadence and Siemens on separate projects to support its plans in the SDV space.
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