Give the people what they want: toward making 3D IC mainstream
Learn more about the five interconnected workflows that are democratizing next generation design in the emerging chiplet age.
Expert Insights
Reliability verification simplified for multi-power domain designs
Automating reliability verification with tools that offer packaged checks provides greater consistency and accuracy across an increasingly complex process.
A three-phase strategy to master the supply chain tsunami
Knowledge, intelligence and optimization are key to managing the logistical disruption seen since the Covid-19 outbreak.
Rising to the verification challenge of open source
Fast emerging options, like RISC-V, could foster massive growth in design but verification still needs commercial tools, a Semicon West panel found.
NVMe-oF – The future of cloud storage
NVMe over Fabrics (NVMe-oF) extends the memory standard for burgeoning data traffic and the demands of AI and machine learning.
Keeping up with rapid innovation in cockpit domain controllers
Automotive cockpit design is being driven forward by prevailing trends in the wider market.
Layout customization improves productivity in design and verification flows
What are the options and how do you balance overarching CAD requirements and personal preferences?
Toward usable and scalable DFT for 3D IC design
Both 3D IC and 2.5D IC techniques are being used on more designs and the DFT infrastructure is evolving to meet the challenges they pose.
Executable specifications boost SoC and IP efficiency
Automating executable specifications as they evolve can deliver major efficiencies.
Use digitalization to mitigate the automotive MCU shortage
The Covid-driven MCU shortage for ECUs and elsewhere in vehicle design can bring entire production lines to a halt if not properly managed.
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