Layout customization improves productivity in design and verification flows
What are the options and how do you balance overarching CAD requirements and personal preferences?
Expert Insights
Toward usable and scalable DFT for 3D IC design
Both 3D IC and 2.5D IC techniques are being used on more designs and the DFT infrastructure is evolving to meet the challenges they pose.
Executable specifications boost SoC and IP efficiency
Automating executable specifications as they evolve can deliver major efficiencies.
Use digitalization to mitigate the automotive MCU shortage
The Covid-driven MCU shortage for ECUs and elsewhere in vehicle design can bring entire production lines to a halt if not properly managed.
Manage today’s advanced vehicle networks E/E design challenges
Linking multiple disciplines, and fully accounting for networks and distributed functionality are vital to automotive E/E design.
Aim for power first for best place-and-route results
The strategy of designing for best power rather than for best timing in place-and-route delivers better results all around.
Siemens’ Sawicki puts priority on scaling in processes, productivity and systems
More optimistic about the semiconductor industries prospects than for some time, Siemens Joe Sawicki identified key EDA challenges at DAC.
Advanced symmetry verification is a thing of beauty
Innovation is extending the technique's power across areas such as context-aware layout, accounting for multi-patterning and implementing fill.
Hit your tapeout schedules with in-design signoff DRC
Delivering physical implementations at new process nodes is getting ever harder. Learn how to stay on track by checking work is rule-compliant as you go.
How ECAD-MCAD integration tackles the challenges of next-gen design
Creating strong links between the electrical and mechanical design domains is a leading enabler of digitalization.
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