August 31, 2022
Intel's Pathfinder for RISC-V is intended to boost the use of the architecture among a wider range of SoC design teams.
August 3, 2022
Accellera is on the first stage of setting up a working group to create a standard for exchanging information on clock domain crossing checks.
July 18, 2022
As the project that funded OpenRoad draws to a close, experts pondered its wider future at the 59th DAC.
June 28, 2022
CXL is a strongly-backed technology aimed at improving connectivity across datacenters handling high demand HPC and AI applications.
June 20, 2022
Intel expects to double logic density through metal scaling and smaller cells with upcoming process.
July 19, 2021
Building products using chiplets involves more than treating them as hard IP cores. Many open questions surround the field, explored by panelists in a MEPTEC conference online.
May 2, 2021
The upcoming VLSI Symposia will feature a number of papers that show the ways in which novel approaches are going to be needed to continue scaling.
January 15, 2021
The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.
December 18, 2020
Work presented at IEDM 2020 shows taking advantage of the IC backside for power and ground for the additional area can deliver further benefits for IR drop and security.
November 9, 2020
This year's IEDM will feature papers that exploit stacked nanoribbons to reduce CMOS footprint, graphene interconnects that support easier integration, and the variability prospects of 2D semiconductors.