Intel

November 9, 2020

IEDM 2020 highlights transistor and interconnect advances

This year's IEDM will feature papers that exploit stacked nanoribbons to reduce CMOS footprint, graphene interconnects that support easier integration, and the variability prospects of 2D semiconductors.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations: , ,
November 3, 2020

Tessent Streaming Scan Network to shrink SoC test writing and runtimes

Mentor's latest additions to Tessent aim to cut test time by a factor of four but remains tailored for increasing design complexity.
Article  |  Topics: Blog Topics  |  Tags: , , , , ,   |  Organizations: , ,
October 15, 2020

DVCon Europe: using all the tools at your disposal

Among the papers that will be presented at the end of October, this year's DVCon Europe will demonstrate the benefits of taking good ideas from wherever you can in the pursuit of more effective verification flows.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations: , , ,
May 26, 2020

Nanometer scaling puts focus on power at VLSI in June

Adaptive power-aware clocking and buried rails are among the techniques to be explored at the 2020 VLSI Symposia.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations: , , , ,
April 30, 2020

Scaling drives targeted analysis of reliability issues

Keynotes at this year’s IRPS conference focused on the way in which scaling is forcing changes to the way that the reliability aspects of semiconductors are examined.
March 24, 2020

Feed fake news to hardware hackers

Intel describes active countermeasures for physical attacks at CICC as part of a trend towards more adaptive IoT silicon.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations:
January 10, 2020

MRAM pushes speed and endurance at IEDM

IEDM late last year showed how MRAM is being prepared for both FD-SOI and advanced finFET nodes.
Article  |  Topics: Blog - IP  |  Tags: , , ,   |  Organizations: , , ,
October 14, 2019

Integration forms highlights of upcoming IEDM

Different forms of heterogeneous integration take center stage at the IEEE International Electron Device Meeting (IEDM) in December this year.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , , ,
September 4, 2019

Future memories not so future any more

Non-volatile alternatives to flash are finally moving out of the lab as Applied Materials launches production tools and Arm starts pushing MRAM.
Article  |  Topics: Blog - Embedded, IP  |  Tags: , , , , ,   |  Organizations: , ,
July 5, 2019
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The road to ES Design West: Design Pavilion

ES Design West aims to help integrate the supply chain but also has plenty of engineering content aimed at low power, security, embedded and more.

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