Embedded magnetic RAM is emerging as a contender for on-chip memory not just from a density standpoint but from that of power.
CMOS moving to 3nm and DRAM going beyond 20nm scaling are two of the late papers at the upcoming IEDM and part of a larger examination of semiconductor trends.
Researchers from the UC Berkeley and Intel teamed up to develop an energy-tuneable RF front-end on a digital finFET process with no need for analog process options.
Intel and GlobalFoundries will talk about their post-14nm finFET-based processes at December's IEDM.
Synopsys has released details on its varied activities at DAC 2017, ranging from panels to technical papers.
Intel subsidiary's new Titanium Control platform pulls the analysis and management of legacy hardware control systems into the cloud.
An ESD Alliance panel on incoming Californian energy regulations originally scheduled for later this month has been postponed.
The major verification conference is looming and Mentor's participation will include tutorials that explore the latest in portable stimulus, SystemC, VIP and more.
Microsoft has launched an OEM version of the Windows Holographic platform it has developed for its own AR headset, the HoloLens.
But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.
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