Intel

The upcoming VLSI Symposia will feature a number of papers that show the ways in which novel approaches are going to be needed to continue scaling.

The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.

Work presented at IEDM 2020 shows taking advantage of the IC backside for power and ground for the additional area can deliver further benefits for IR drop and security.

This year's IEDM will feature papers that exploit stacked nanoribbons to reduce CMOS footprint, graphene interconnects that support easier integration, and the variability prospects of 2D semiconductors.

Mentor's latest additions to Tessent aim to cut test time by a factor of four but remains tailored for increasing design complexity.

Among the papers that will be presented at the end of October, this year's DVCon Europe will demonstrate the benefits of taking good ideas from wherever you can in the pursuit of more effective verification flows.

Adaptive power-aware clocking and buried rails are among the techniques to be explored at the 2020 VLSI Symposia.

Keynotes at this year’s IRPS conference focused on the way in which scaling is forcing changes to the way that the reliability aspects of semiconductors are examined.

Intel describes active countermeasures for physical attacks at CICC as part of a trend towards more adaptive IoT silicon.

IEDM late last year showed how MRAM is being prepared for both FD-SOI and advanced finFET nodes.