July 25, 2023
Tessolve is bringing its Verification Futures conference to the US with an event scheduled for mid-September.
July 24, 2023
Backside power delivery could lead to improvements in chip density and more straightforward place-and-route phases according to work presented at this year’s VLSI Symposium.
April 13, 2023
Intel Foundry Services has signed a deal with Arm that will see the two companies work on a program of system and design-technology co-optimization.
August 31, 2022
Intel's Pathfinder for RISC-V is intended to boost the use of the architecture among a wider range of SoC design teams.
August 3, 2022
Accellera is on the first stage of setting up a working group to create a standard for exchanging information on clock domain crossing checks.
July 18, 2022
As the project that funded OpenRoad draws to a close, experts pondered its wider future at the 59th DAC.
June 28, 2022
CXL is a strongly-backed technology aimed at improving connectivity across datacenters handling high demand HPC and AI applications.
June 20, 2022
Intel expects to double logic density through metal scaling and smaller cells with upcoming process.
July 19, 2021
Building products using chiplets involves more than treating them as hard IP cores. Many open questions surround the field, explored by panelists in a MEPTEC conference online.
May 2, 2021
The upcoming VLSI Symposia will feature a number of papers that show the ways in which novel approaches are going to be needed to continue scaling.