Intel

The upcoming VLSI Symposium will examine progress in using backside contacts and 3D structures to improve density and speed as well as continuing improvements to finFET processes.

Cadence has agreed to work with Intel Foundry Services on IP and flows for the 18A process, which will include backside power delivery and nanosheet transistors.

Vertical integration is one of the major focus areas at the upcoming IEDM conference, both in terms of transistors and the multiple channels that will go into them.

Tessolve is bringing its Verification Futures conference to the US with an event scheduled for mid-September.

Backside power delivery could lead to improvements in chip density and more straightforward place-and-route phases according to work presented at this year’s VLSI Symposium.

Intel Foundry Services has signed a deal with Arm that will see the two companies work on a program of system and design-technology co-optimization.

Intel's Pathfinder for RISC-V is intended to boost the use of the architecture among a wider range of SoC design teams.

Accellera is on the first stage of setting up a working group to create a standard for exchanging information on clock domain crossing checks.

As the project that funded OpenRoad draws to a close, experts pondered its wider future at the 59th DAC.

CXL is a strongly-backed technology aimed at improving connectivity across datacenters handling high demand HPC and AI applications.