As 2D scaling becomes increasingly difficult, researchers reporting at VLSI Symposia have focused attention on what can be done in the third dimensions to improve density and performance without a sudden break from conventional CMOS processes.
Imec and Unisantis Electronics have developed a process flow based on a vertical transistor with a gate on all sides they claim will lead to denser memories on a 5nm node.
Samsung Electronics will describe at the upcoming VLSI Symposia how its engineers have applied EUV to a variety of layers in a 7nm finFET process.
IMEC has claimed at IEDM to have implemented for the first time the CMOS integration of vertically stacked nanowire transistors.
A novel approach to 3D NAND will be among the presentations at the International Electron Device Meeting to be held in Washington, DC in December.
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