Chipmaking’s new environment presented at IEDM
Imec's senior vice president of CMOS outlined future directions for the technology over the coming decade.
finFET
TSMC fills in sub-nodes as EUV gains ground
TSMC is using its growing experience with EUV lithography to fill in sub-nodes between its major releases as it prepares to extend finFET technology to the forthcoming N3 process.
Nanometer scaling puts focus on power at VLSI in June
Adaptive power-aware clocking and buried rails are among the techniques to be explored at the 2020 VLSI Symposia.
GlobalFoundries takes aim at TSMC’s customers in patent action
GlobalFoundries is calling for imports of chips fabbed by TSMC into the US and Germany in multiple actions based on a list of 16 patents.
Graphcore licenses ESD protection from Sofics
Graphcore has licensed IP from Belgium-based Sofics to protect its Colossus GC2 processors from ESD.
GlobalFoundries stops 7nm work to focus on existing processes
GlobalFoundries has decided to put development of its 7nm process on the backburner and focus on its existing finFET and FD-SOI processes.
Node-variant FinFET tweaks try to improve cost, performance
Foundries have taken aim at standard-cell track height and design-rule tweaks to try to improve the area efficiency and performance of derivative finFET processes.
Samsung couples EUV with DTCO for 7nm shrink
Samsung Electronics expects to increase savings on die area in the shift from its 10nm to 7nm node by applying both EUV for critical layers and several layout-focused process changes.
SAR-VCO combo tunes RF receiver power on 16nm
Researchers from the UC Berkeley and Intel teamed up to develop an energy-tuneable RF front-end on a digital finFET process with no need for analog process options.
Mixed-signal circuits push scaled CMOS at VLSI
The circuits sessions at mid-June's VLSI Symposia in Honolulu feature a number of papers that improve the performance of scaled mixed-signal processes.
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