What will 3D integration look like? IEDM 2016 explored some of the options ranging from IoT sensors to advanced logic.
IMEC has claimed at IEDM to have implemented for the first time the CMOS integration of vertically stacked nanowire transistors.
At the 62nd annual IEDM taking place in early December two of the leading groups in process development will take the wraps off their 7nm finFET technologies.
The International Electron Device Meeting has pushed back the deadline for its papers to get the latest developments in process and device design into the December conference.
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