IEDM 2016


December 12, 2016

IEDM explores faces of 3D monolithic integration

What will 3D integration look like? IEDM 2016 explored some of the options ranging from IoT sensors to advanced logic.
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December 7, 2016

IMEC stacks nanowire transistors together on CMOS

IMEC has claimed at IEDM to have implemented for the first time the CMOS integration of vertically stacked nanowire transistors.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations:
October 24, 2016

7nm finFET process techniques lead IEDM lineup

At the 62nd annual IEDM taking place in early December two of the leading groups in process development will take the wraps off their 7nm finFET technologies.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations:
July 22, 2016

IEDM alters schedule to keep abreast of process updates

The International Electron Device Meeting has pushed back the deadline for its papers to get the latest developments in process and device design into the December conference.
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