DAC 2017 preview: ESD Alliance
EDA's leading association will be visible across the program at DAC 2017 from CEO interviews to social events.
Mentor Graphics
Mentor builds links for multichip package integration
Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.
DAC 2017 preview: Mentor
Mentor, a Siemens business, has released details on its varied activities at DAC 2017, ranging from panels to technical papers.
How Mentor realized concurrent engineering for PCB design
The vendor's experiences in enabling concurrent engineering in Xpedition Enterprise contain lessons for all design disciplines.
Toshiba case study describes advanced thermal simulation
Japanese giant uses variable thermal simulation on automotive IC intended for harsh environments.
Master the verification challenge of PCIe-based NVMe storage
NVMe is driving the SSD market thanks to its many useful features, but at least five major challenges must inform your verification plan.
Wally Rhines looks beyond ‘endless verification’ to the system era
DVCon China saw Mentor's chairman and CEO give a typically thorough keynote on the evolving challenges for verification.
DVCon China looms as submission deadline for Europe approaches
The first Chinese edition of Accellera's conference series takes place in Shanghai next Wednesday (April 19).
Leverage AI and centralized processing for L-5 autonomous vehicles
L-5 autonomous vehicles need centralized raw data analysis with machine learning to cope with the demands of ASIL-D functional safety. Mentor's response is DRS360.
Bridging the gap between IP development and qualification for P&R
Learn how to pre-empt timing and congestion issues that could arise after synthesis by using 'PlaceFirst' technology within Oasys-RTL.