IEDM late last year showed how MRAM is being prepared for both FD-SOI and advanced finFET nodes.
GlobalFoundries and TSMC have called off their legal battle with a wide-ranging patent cross-licensing deal.
GlobalFoundries is calling for imports of chips fabbed by TSMC into the US and Germany in multiple actions based on a list of 16 patents.
An Open Compute Project group working on multichip integration sees a combination of parallel and serial interfaces being important for interchip communication.
The ODSA Workgroup formed by Netronome and others is looking to adopt the PIPE standard for interconnecting chiplets as it starts work on a proof-of-concept module.
Embedded magnetic RAM is emerging as a contender for on-chip memory not just from a density standpoint but from that of power.
Data-center networking specialist Netronome has recruited a number of silicon makers and IP suppliers to a standard for chiplet designs that can be used in SIPs for edge computers and servers.
GlobalFoundries has decided to put development of its 7nm process on the backburner and focus on its existing finFET and FD-SOI processes.
FD-SOI is gradually building up a presence as a technology not just for low-power but RF and power integration.
Foundries have taken aim at standard-cell track height and design-rule tweaks to try to improve the area efficiency and performance of derivative finFET processes.
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