MRAM pushes speed and endurance at IEDM
IEDM late last year showed how MRAM is being prepared for both FD-SOI and advanced finFET nodes.
GlobalFoundries
Foundries call off patent war
GlobalFoundries and TSMC have called off their legal battle with a wide-ranging patent cross-licensing deal.
GlobalFoundries takes aim at TSMC’s customers in patent action
GlobalFoundries is calling for imports of chips fabbed by TSMC into the US and Germany in multiple actions based on a list of 16 patents.
ODSA weighs options for chiplet interconnect
An Open Compute Project group working on multichip integration sees a combination of parallel and serial interfaces being important for interchip communication.
PCI may provide key to OCP chiplet standard
The ODSA Workgroup formed by Netronome and others is looking to adopt the PIPE standard for interconnecting chiplets as it starts work on a proof-of-concept module.
IEDM shows progress on embedded eMRAM
Embedded magnetic RAM is emerging as a contender for on-chip memory not just from a density standpoint but from that of power.
Netronome launches chiplet initiative for network-accelerator SIPs
Data-center networking specialist Netronome has recruited a number of silicon makers and IP suppliers to a standard for chiplet designs that can be used in SIPs for edge computers and servers.
GlobalFoundries stops 7nm work to focus on existing processes
GlobalFoundries has decided to put development of its 7nm process on the backburner and focus on its existing finFET and FD-SOI processes.
With RF, power and MRAM, FD-SOI finds its role
FD-SOI is gradually building up a presence as a technology not just for low-power but RF and power integration.
Node-variant FinFET tweaks try to improve cost, performance
Foundries have taken aim at standard-cell track height and design-rule tweaks to try to improve the area efficiency and performance of derivative finFET processes.
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