Research Groups

At IEDM 2014, CEA-Leti presented a technique that prevents damage to base-layer transistors in monolithic 3DIC processes. As work progresses, the institute is preparing to receive 3DIC designs in 2017.

Process development alliance will enable Imec to experiment on 10 and 7nm processes in the computer before moving to the fab

EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.

Despite the swirl of interest in the internet of things progress is likely to be held back by interoperability issues according to speakers at the recent NI Week conference.

Technology from advanced-physics research institute CERN will form part of National Instruments' long-term strategy to improve the ability of distributed systems to support real-time control.

At the VLSI Technology Symposium a team led by STMicroelectronics described the techniques used for the upcoming 14nm FD-SOI to boost speed and density over the 28nm version.

The 2013 edition of the International Technology Roadmap for Semiconductors has been published. The latest set of tables underlines the slowdown in some aspects of scaling, particularly when it comes to metal interconnect.

Power converters are arriving on the market with the aim of simplifying the job of building energy-harvesting systems for wireless sensor nodes and the Internet of Things.

IMEC's Rudy Lauwereins explained at DATE 2014 how 1D routing for self-aligned multiple patterning is likely to be inevitable even if EUV makes it into production fabs.

What's in a millisecond? The difference between today's embedded systems and tomorrow's, Professor Gerhard Fettweis of TU of Dresden said at DATE 2014.