All engines in the place-and-route software have been boosted with cuts to runtime and memory footprint.
Packetized test and three new technologies provide the core of the company's DFT presentations during the virtual International Test Conference running this week.
Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.
Siemens EDA has become the first of the major EDA vendors to join the DARPA Toolbox Initiative.
A three-pronged digital twin strategy can help aviation and defense companies master increasing complexity in electrical implementations.
A Siemens Tessent white papers examines the role of safety islands in advanced automotive systems.
A DVCon technical paper addresses potential reset domain crossing metastability issues due to UPF instrumentation.
The need for the electrical and mechanical design domains to inform one another in more detail is recognized, but how do you do it?
A Siemens white paper describes a way of automatically deriving information from 2.5D/3DIC designs to streamline latchup design-rules verification.
A detailed technical overview of formal verification within the context of the DO-254 (ED-80) standard is now available to download.
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