Siemens EDA

March 14, 2024

Two projects to deliver digital twins for software-defined vehicles

Arm is working with Cadence and Siemens on separate projects to support its plans in the SDV space.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , ,
January 21, 2024

Take a deeper dive into BCI-ROM

A new paper looks at examples for using The Boundary Condition Independent Reduced Order Model (BCI-ROM) in its VHDL-AMS implementation for electro-thermal analysis.
Article  |  Topics: Digital/analog implementation, Standards, Verification  |  Tags: , , , ,   |  Organizations:
November 30, 2023

Benchmarking the maturity of AI in EDA

Solido discusses how it has leveraged AI for SPICE level efficiency and the benchmarks it has used.
November 20, 2023

ETRI builds flow for AI chiplets

South Korea's leading research institute has built a reusable flow for lower power petaflops-performance AI.
Article  |  Topics: Blog - EDA, - HPC, Next Generation Design, Packaging, Verification  |  Tags: , , ,   |  Organizations: , ,
November 17, 2023

Siemens takes automotive digital twin to the AWS cloud

Siemens has made its PAVE360 automotive digital-twin software available on AWS, with the ability to access fast Arm models on the same cloud.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , ,   |  Organizations: , ,
November 15, 2023

Siemens buys Insight for reliability addition to Calibre

Siemens has completed the acquisition of Insight EDA, a specialist in circuit-reliability analysis.
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations:
October 24, 2023

Flow evolution for the 3DIC/chiplet age

Chiplet-based 3DIC designs present new challenges for flows that integrate tasks from design exploration to physical verification.
October 9, 2023

ITC 2023 preview: Siemens DIS

From tutorials to technical papers to special 'diamond' sessions, Tessent features large at ITC 2023.
Article  |  Topics: EDA - DFT  |  Tags:   |  Organizations: , , ,
October 9, 2023

Tessent speeds ‘shift left’ drive for test at RTL

Tessent RTL Pro allows wrapper cells and x-bounding logic to be inserted earlier in designs.
Article  |  Topics: Blog Topics, Design to Silicon, EDA - DFT  |  Tags: , , , ,   |  Organizations:
October 3, 2023

Siemens and CEA link up on AI-assisted digital twins

Siemens and CEA-List have signed a deal under which the two organisations will research the combination of digital-twin and AI.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , ,   |  Organizations:

PLATINUM SPONSORS

Synopsys Cadence Design Systems Siemens EDA
View All Sponsors