Siemens EDA

June 28, 2022

Coherency verification for CXL

CXL is a strongly-backed technology aimed at improving connectivity across datacenters handling high demand HPC and AI applications.
June 16, 2022

TSMC certifies Aprisa for N5 and N4

TSMC has certified the Aprisa place-and-route software from Siemens Digital Industries Software for the N5 and N4 process technologies.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations:
May 25, 2022

Siemens brings ReadyStart RTOS to RISC-V

Siemens has expanded its Nucleus ReadyStart program to the RISC-V architecture.
Article  |  Topics: Blog - Embedded  |  Tags: , , , ,   |  Organizations:
April 29, 2022

Navigate variables and lifetimes in SystemVerilog

Variable lifetimes are an apparently basic but also tricky feature within the verification language.
Article  |  Topics: Verification  |  Tags: , , , , ,   |  Organizations: ,
April 28, 2022

Go inside proposals for common chiplet models

Chiplets will need models to guarantee heterogenous SiP implementation. A cross-industry working group describes its progress so far.
April 27, 2022

Verifying the new namespace storage options in NVMe 2.0

The NVMe 2.0 specification has introduced two namespace options that boost SSD performance while optimizing storage life.
Article  |  Topics: Blog - EDA, - Verification  |  Tags: , , , ,   |  Organizations:
March 13, 2022

Learn strategies for better measurement and test in simulation-based PCB design

A new white paper offers useful tips and techniques for PDN analysis and performance optimization in designs such as those using DDR4.
Article  |  Topics: Blog - PCB  |  Tags: , , , , ,   |  Organizations:
February 10, 2022

Capturing connectivity for assembly verification in 2.5D and 3D design

Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.
Article  |  Topics: Verification  |  Tags: , , , , , , , , ,   |  Organizations:
February 8, 2022

How digital twin evaluations optimize STCO-based design

System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.
January 25, 2022

Silicon Photonics verification case study from UC-Davis and Texas A&M

Silicon Photonics 3D integration posed LVS challenges in this fast emerging technical space. A case study describes how the two institutions overcame them.
Article  |  Topics: Verification  |  Tags: , ,   |  Organizations: , ,

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