GSA

March 11, 2016

GSA on how to reinvigorate silicon business models

Open-source hardware, in-field configurability, and a hardware-plus-services approach could protect margins as the IoT hammers down costs, says GSA report.

Article | Topics: Commentary, Blog - EDA, Embedded, IP, - Market Research, Product, Standards | Tags: Arduino, FPGA, in-field programmability, instruction set architecture, internet of things, MinnowBoard, open-source hardware, open-source software, PLD, Raspberry Pi, TinkerForge | Organizations: Altera, Gary Smith EDA, Google, GSA, Intel, Maxim Integrated, Microsemi, Oracle, STMicroelectronics, UC Berkeley

November 7, 2013

TSMC demonstrates readiness for 3D-IC

Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.

Article | Topics: Commentary, Conferences, Design to Silicon | Tags: 2.5D-IC, 3D, 3D-IC, InFO interposer, interposer, silicon interposer | Organizations: GSA, TSMC

October 23, 2013

3D-IC focus for GSA’s Taipei Memory+ event next week

Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.