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3D-IC Stack LVS Connectivity

Building confidence and flexibility in 3D-IC system level design

3D-IC presents major connectivity challenges in maintaining a golden netlist and managing necessary exceptions. Learn how to manage them.

Guides

  • Monolithic 3DIC for SoC

    EDA - Technologies

    Monolithic 3DIC integration may provide a viable alternative to conventional 2D scaling for SoCs if manufacturing problems can be overcome.

  • Interconnect resistance

    EDA - Techniques

    A number of effects have led to a dramatic increase in interconnect resistance in the sub-32nm process nodes that demands the use of smarter routing.

  • Real-number or wreal modeling

    EDA - Techniques

    Real-valued modelling provides a way of speeding up the simulation of SoCs with significant analog content through the use of discrete-event solvers.

Expert Insights

Stephen V. Chavez

A three-phase strategy to master the supply chain tsunami

Stephen Chavez is a senior printed circuit engineer and a Senior Product Marketing Manager at Siemens EDA. Stephen is an IPC Certified Master Instructor Trainer (MIT) for PCB design, an IPC Certified Advanced PCB Designer (CID+), and a Certified Printed Circuit Designer (CPCD). He is chairman of the Printed Circuit Engineering Association (PCEA)

Knowledge, intelligence and optimization are key to managing the logistical disruption seen since the Covid-19 outbreak.

SEMICON West special report

Rising to the verification challenge of open source

Fast emerging options, like RISC-V, could foster massive growth in design but verification still needs commercial tools, a Semicon West panel found.

Dhruv Garg

NVMe-oF – The future of cloud storage

NVMe over Fabrics (NVMe-oF) extends the memory standard for burgeoning data traffic and the demands of AI and machine learning.

EDA

  1. Jeff Hancock is a Senior Product Manager in the Embedded Platform Technology Business Unit of Mentor, A Siemens Business. He oversees the Nucleus and Mentor Embedded Hypervisor runtime product lines, as well as associated middleware and professional services.
    Expert Insight Keeping up with rapid innovation in cockpit domain controllers

    Automotive cockpit design is being driven forward by prevailing trends in the wider market.

  2. Article A quick and easy way to calculate P2P resistance and current density
  3. Expert Insight Layout customization improves productivity in design and verification flows

PCB

  1. Matthew Walsh is a Product Marketing Manager in the Electronic Board Systems division of Siemens Digital Industries Software, responsible for all cloud solutions. He has more than 25 years of experience in semiconductor and electronics marketing, sales, and application engineering. He earned his BSEE at the University of Massachusetts. Matt is an avid skier and science fiction geek.
    Expert Insight May the Cloud be with you

    How to unify your design team to defeat the dark side of board systems design.

  2. Article The five pillars of digital transformation for electronics system design
  3. Expert Insight The best in 2020 PCB design

IP

  1. Formal verification for SystemC thumbnail
    Article Formal verification for SystemC/C++ designs

    Automated formal technologies can be used to ease the debug and functional verification burden of SystemC/C++ code prior to high-level synthesis. This tutorial, first presented at DVCon Europe explores how these formal techniques can be deployed and provides real-world examples.

  2. Article Resolving IP cell-name conflicts peacefully
  3. Article How to use runtime monitoring for automotive functional safety

Embedded

  1. Brendan Morris is a senior technical marketing manager for the Integrated Electrical Systems group, Siemens Digital Industries Software. He spent his early career working in Automotive Tier 1 suppliers, working on a diverse range of technologies and vehicle types, including software development in powertrain electronics. He spent the next 10 years working for several vehicle OEM's at all stages of vehicle development programs. Brendan holds an M.Eng degree in Automotive Engineering from Loughborough University.
    Expert Insight Use digitalization to mitigate the automotive MCU shortage

    The Covid-driven MCU shortage for ECUs and elsewhere in vehicle design can bring entire production lines to a halt if not properly managed.

  2. Expert Insight Implementing medical device security for optimal outcomes
  3. Expert Insight How to choose between a hypervisor and a multicore framework

Briefing

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