Research Groups

December 7, 2016

IMEC stacks nanowire transistors together on CMOS

IMEC has claimed at IEDM to have implemented for the first time the CMOS integration of vertically stacked nanowire transistors.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations:
December 7, 2016

Overcoming electromigration analysis limitations for larger on-die power grids

Award-winning paper describes new strategy offering both greater speed and accuracy.
Article  |  Topics: Blog Topics  |  Tags: , , ,   |  Organizations: , ,
June 9, 2016

2D tools adapt to create smaller monolithic 3DIC designs

Researchers at the Georgia Institute of Technology adapted conventional 2D layout tools to a two-layer monolithic 3D process that resulted in sizeable space and power savings.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations:
June 8, 2016

Minimize memory moves for greener data centers

Deep pipelines and dynamic memory sharing may provide the key to the development of faster and more efficient server-farm blades as the focus in hardware design moves to augmenting conventional processors with specialized accelerators.
April 7, 2016

SNUG 2016: Intel, TSMC, GloFo back post-finFET research at UC Berkeley

But project lead Chenming Hu, 'finFET's father', has also highlighted important changes in the funding landscape for university research.
March 11, 2016

GSA on how to reinvigorate silicon business models

Open-source hardware, in-field configurability, and a hardware-plus-services approach could protect margins as the IoT hammers down costs, says GSA report.
December 15, 2015

GaN power makes progress at IEDM 2015

Researchers describe at IEDM 2015 how they are making gallium nitride fit into a wider range of power-handling applications and may even result in mass-market vertical transistors.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , ,   |  Organizations: ,
December 7, 2015

Asymmetric variability issues could impact 7nm processes

Simulation shows 7nm process will need tighter variability control than expected, and possibly accommodation for asymmetric variability
Article  |  Topics: Conferences, Design to Silicon  |  Tags: , , ,   |  Organizations: , ,
November 12, 2015

DVCon Europe: UVM-SystemC backers ready first draft

But the bridge standard's European backers still need greater support from the big EDA vendors.
October 9, 2015

IMEC 5nm test chip to explore EUV and SAQP litho options

IMEC and Cadence have taped out a test chip intended to explore key lithography and metal-interconnect issues that will face users of the forthcoming 5nm process node.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: ,

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