Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.
System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.
Silicon Photonics 3D integration posed LVS challenges in this fast emerging technical space. A case study describes how the two institutions overcame them.
Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.
Siemens software will be used to accelerated the development of commercial aircraft.
Siemens has refreshed its collaboration with PDF Solutions with the aim of using test data and other sources to provide actionable information to improve device yield.
FHE use-cases are evolving and the NextFlex consortium is looking to smooth their path with a strategy, PDKs and reference modules.
DAC 2021 is looming and here is our first round up of a major EDA player's plans for the physical event in San Francisco.
A new white paper examines how to develop architectures around the main E/E elements placing growing demands on automotive engineering teams.
Arm has used machine-learning tools supplied by the Solido group at Siemens Digital Industries Software to speed up IP validation runtime a thousand-fold compared to conventional statistical methods.
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