Physical design


October 24, 2023

Flow evolution for the 3DIC/chiplet age

Chiplet-based 3DIC designs present new challenges for flows that integrate tasks from design exploration to physical verification.
August 8, 2023

Catch up with the state-of-the-art in ‘shift left’

Just how much of the flow has already has 'shift left' benefit and what is fueling further progress.
July 14, 2023

Cadence mixes know-how and AI to bridge RTL gap

The Joules RTL Design Studio aims to make coding more aware of aware of physical issues before and after hand-off for implementation.
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December 1, 2022

Identifying AI opportunities in PCB design

The key to exploiting AI is being clear about where its family of technologies can help to improve and democratize design.
November 23, 2022

Chipletz pushes packaging design for AI, HPC and immersive use-cases

The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.
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November 23, 2021

DAC 2021 Preview: Siemens EDA

DAC 2021 is looming and here is our first round up of a major EDA player's plans for the physical event in San Francisco.
October 12, 2021

Aprisa place-and-route software gets major upgrade

All engines in the place-and-route software have been boosted with cuts to runtime and memory footprint.
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