IEEE1838

September 27, 2022

Siemens automates test to handle multi-die 2.5D, 3D and 5.5D architectures

Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.

Article | Topics: EDA - DFT | Tags: 2.5D, 3D, 5D, chiplet, IEEE1149.1, IEEE1687, IEEE1838, interconnect, interposer, stacked die, TSV | Organizations: Siemens EDA

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