Siemens EDA

December 9, 2021

PDF and Siemens renew links for yield insights

Siemens has refreshed its collaboration with PDF Solutions with the aim of using test data and other sources to provide actionable information to improve device yield.
Article  |  Topics: Digital Twin, Blog - EDA  |  Tags: , , ,   |  Organizations: ,
December 9, 2021

Flexible hybrid electronics: Making an emerging tech happen with PDKs and reference designs

FHE use-cases are evolving and the NextFlex consortium is looking to smooth their path with a strategy, PDKs and reference modules.
November 23, 2021

DAC 2021 Preview: Siemens EDA

DAC 2021 is looming and here is our first round up of a major EDA player's plans for the physical event in San Francisco.
November 17, 2021

Balancing the requirements of E/E architectures for automotive design

A new white paper examines how to develop architectures around the main E/E elements placing growing demands on automotive engineering teams.
October 26, 2021

Arm accelerates library verification with Solido ML

Arm has used machine-learning tools supplied by the Solido group at Siemens Digital Industries Software to speed up IP validation runtime a thousand-fold compared to conventional statistical methods.
Article  |  Topics: Blog - EDA, IP  |  Tags: , ,   |  Organizations: ,
October 22, 2021

Digitalization beyond the enterprise

What companies do internally to digitalize matters, but so does using the concept to optimize their supply chain with partners.
October 12, 2021

Aprisa place-and-route software gets major upgrade

All engines in the place-and-route software have been boosted with cuts to runtime and memory footprint.
Article  |  Topics: Blog - EDA, - Physical design  |  Tags: , , ,   |  Organizations:
October 11, 2021

ITC 2021 preview: Siemens Digital Industries Software

Packetized test and three new technologies provide the core of the company's DFT presentations during the virtual International Test Conference running this week.
Article  |  Topics: EDA - DFT, Blog - EDA  |  Tags: , , ,   |  Organizations: ,
September 28, 2021

Scaling power integrity analysis to match analog content in today’s designs

Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.
September 24, 2021

Siemens brings chip-design flow to DARPA Toolbox Initiative

Siemens EDA has become the first of the major EDA vendors to join the DARPA Toolbox Initiative.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , ,   |  Organizations: , , , ,

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