substrate


June 1, 2023

Does 2.5DIC call for IC design tools for the packaging?

Siemens has published a white paper that examines whether package designers need to adopt IC tools and design styles in the move from organic packages to 2.5DIC packages.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , , , ,   |  Organizations:
November 23, 2022

Chipletz pushes packaging design for AI, HPC and immersive use-cases

The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.

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