Early package assembly verification for faster, better results
Make it easier to capture issues in 2.5D and 3D designs with multiple chiplets and emerging challenges with this 'shift left' approach.
2.5D
Siemens automates test to handle multi-die 2.5D, 3D and 5.5D architectures
Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.
Capturing connectivity for assembly verification in 2.5D and 3D design
Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.
How digital twin evaluations optimize STCO-based design
System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.
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