IEEE1687


September 27, 2022

Siemens automates test to handle multi-die 2.5D, 3D and 5.5D architectures

Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.
Article  |  Topics: EDA - DFT  |  Tags: , , , , , , , , , ,   |  Organizations:

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