3D


February 10, 2022

Capturing connectivity for assembly verification in 2.5D and 3D design

Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.
Article  |  Topics: Verification  |  Tags: , , , , , , , , ,   |  Organizations:
February 8, 2022

How digital twin evaluations optimize STCO-based design

System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.
January 25, 2022

Silicon Photonics verification case study from UC-Davis and Texas A&M

Silicon Photonics 3D integration posed LVS challenges in this fast emerging technical space. A case study describes how the two institutions overcame them.
Article  |  Topics: Verification  |  Tags: , ,   |  Organizations: , ,
January 25, 2022

Choose the right advanced packaging methodology for metal fill rules

Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.
November 7, 2013

TSMC demonstrates readiness for 3D-IC

Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.
Article  |  Topics: Commentary, Conferences, Design to Silicon  |  Tags: , , , , ,   |  Organizations: ,
March 19, 2013

DATE: Dark clouds gather over 3D integration, panelist tells conference

The chip industry faces problems as foundries and the packaging industry compete over 3D technologies. If resolved, it could mean a new dawn in ASIC design.
Article  |  Topics: Conferences, Blog - EDA  |  Tags: , , , , , ,
March 8, 2012

ISQED focuses on systems, education and sensors

The International Symposium on Quality Electronic Design (ISQED) enters its 13th edition later this month, running March 19-21 at Techmart in Santa Clara. Although ISQED traditionally concentrated on tools and IP blocks, its agenda has broadened as the industry has migrated to SoCs and full electronic systems where process and manufacturing interactions have come to […]

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