3D


November 7, 2013

TSMC demonstrates readiness for 3D-IC

Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.
Article  |  Topics: Commentary, Conferences, Design to Silicon  |  Tags: , , , , ,   |  Organizations: ,
March 19, 2013

DATE: Dark clouds gather over 3D integration, panelist tells conference

The chip industry faces problems as foundries and the packaging industry compete over 3D technologies. If resolved, it could mean a new dawn in ASIC design.
Article  |  Topics: Conferences, Blog - EDA  |  Tags: , , , , , ,
March 8, 2012

ISQED focuses on systems, education and sensors

The International Symposium on Quality Electronic Design (ISQED) enters its 13th edition later this month, running March 19-21 at Techmart in Santa Clara. Although ISQED traditionally concentrated on tools and IP blocks, its agenda has broadened as the industry has migrated to SoCs and full electronic systems where process and manufacturing interactions have come to […]

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