The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.
System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.
FHE use-cases are evolving and the NextFlex consortium is looking to smooth their path with a strategy, PDKs and reference modules.
Latest acquisition adds technologies to mitigate rising verification time and cost for third-party IP.
A new white paper reviews the history of the open-source platform and provides guidance on best practice development for embedded.
Use of the open-source RISC-V processor was tracked for the first time by the biennial study, finding notably high take-up.
A Japanese component supplier is making it easier for its customers to choose the right parts for their designs by offering a powerful analog and mixed-signal (AMS) simulation environment through its website.
Mentor will have a very broad presence at DVCon across technologies such as HLS, formal verification, simulation and emulation.
Mythic will use the Mentor tools for its analog-targeted intelligence processing units.
Emulation is already playing a vital role in advanced automotive design within a digital twin environment.
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