Catch up with the state-of-the-art in ‘shift left’
Just how much of the flow has already has 'shift left' benefit and what is fueling further progress.
Next Generation Design
Chipletz pushes packaging design for AI, HPC and immersive use-cases
The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.
How digital twin evaluations optimize STCO-based design
System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.
Flexible hybrid electronics: Making an emerging tech happen with PDKs and reference designs
FHE use-cases are evolving and the NextFlex consortium is looking to smooth their path with a strategy, PDKs and reference modules.
Siemens extends Solido’s reach into IP validation with Fractal
Latest acquisition adds technologies to mitigate rising verification time and cost for third-party IP.
Getting a RISC-V embedded toolchain in place
A new white paper reviews the history of the open-source platform and provides guidance on best practice development for embedded.
RISC-V in nearly a quarter of designs (Wilson Functional Verification 2020 – Part One)
Use of the open-source RISC-V processor was tracked for the first time by the biennial study, finding notably high take-up.
ROHM eases component choice by offering cloud simulation and collaboration environment
A Japanese component supplier is making it easier for its customers to choose the right parts for their designs by offering a powerful analog and mixed-signal (AMS) simulation environment through its website.
DVCon US 2020 preview: Mentor
Mentor will have a very broad presence at DVCon across technologies such as HLS, formal verification, simulation and emulation.
AI processor company opts for Analog FASTSPICE and Symphony
Mythic will use the Mentor tools for its analog-targeted intelligence processing units.
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