5G IC designs have needed aggressive innovation across many elements and more use of FD-SOI that both pose parasitic extraction challenges.
The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.
Mentor adds Analog FastSPICE eXTreme innovations for designs facing increasing parasitic complexity and contact resistance challenges at cutting edge nodes.
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