Real Intent tool looks at paths to hardware vulnerability
Real Intent has developed a tool for identifying potential security issues in chip designs at the sign-off stage.
Tech Design Forum Briefing
Briefing Authors
Paul Dempsey
Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
Luke Collins
Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.
Chris Edwards
Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
Alphawave incorporates Neoverse into chiplet clusters
Alphawave Semi has collaborated with Arm on the development of an advanced compute chiplet based on Arm’s Neoverse compute subsystems.
Imec cleans up process for 2µm-pitch 3DIC stacks
Imec has developed cleaner techniques for preparing die-to-wafer bonding components for high-density logic-memory stacks and optical integration.
IEDM call for papers looks for tomorrow’s semiconductors
The 70th annual IEDM is putting together its next conference under the theme under the theme “shaping tomorrow’s semiconductor technology”.
Dense packaging focus for ECTC
This year’s ECTC, held at the end of May, will continue its focus on the role of packaging in keeping silicon scaling on track.
VLSI to explore vertical device changes and 3nm finFET
The upcoming VLSI Symposium will examine progress in using backside contacts and 3D structures to improve density and speed as well as continuing improvements to finFET processes.
Abaco adopts Covid-19 lessons for HPC design
Mil/aero specialist Abaco Systems refined its workflow across multiple design sites after the pandemic constrained collaboration.
Beyond manual PCB routing
PCB routing is best served by a mixture of manual and automated tasks. A new e-book describes the boundaries between the two.
Putting chiplet design on the ‘smart path’
The flat nature of traditional IC packaging design struggles to cope with the chiplet era. Homogeneous disaggregation offers an alternative.
Rigid-flex: get the book for an inside view
The technique is becoming increasingly important for designs that need to be flexible, compact and lightweight.
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