Three ways to 3D feature at IEDM
Three highlighted papers at IEDM, taking place in December, show the different approaches to the use of the vertical dimension to cut energy use and improve density.
Tech Design Forum Briefing
Briefing Authors
Paul Dempsey
Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
Luke Collins
Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.
Chris Edwards
Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
DAC prepares for winter show
The program for the 58th Design Automation Conference, which returns to a physical format in December, is online and is running its I Love DAC promotion for free access until the end of this month.
DVCon events stick with virtual format and add speakers
DVCon US use a virtual platform for its event to be held in the spring and the organisers of the European event will employ a more sophisticated version of the virtual 3D space debuted last year.
Aprisa place-and-route software gets major upgrade
All engines in the place-and-route software have been boosted with cuts to runtime and memory footprint.
ITC 2021 preview: Siemens Digital Industries Software
Packetized test and three new technologies provide the core of the company’s DFT presentations during the virtual International Test Conference running this week.
Combined database underpins 3DIC design suite
Cadence has built a unified database to support a group of tools to support the planning and implementation of 3DIC designs.
Scaling power integrity analysis to match analog content in today’s designs
Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today’s ICs.
Siemens brings chip-design flow to DARPA Toolbox Initiative
Siemens EDA has become the first of the major EDA vendors to join the DARPA Toolbox Initiative.
Digital twins manage change in E/E design for aerospace
A three-pronged digital twin strategy can help aviation and defense companies master increasing complexity in electrical implementations.
Cadence organizes on-device AI into three families
Cadence has organized its machine-learning platforms into three families intended to cover a wide range of on-device AI applications.
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