Tech Design Forum Briefing


Briefing Authors

Paul Dempsey

Paul Dempsey Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.

Luke Collins

Luke Collins Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.

Chris Edwards

Chris Edwards Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
January 22, 2021

How to use virtual mode in emulation

Virtual strategies make for greater productivity and widen the number of emulation use cases. A new paper considers some of the most popular examples.

January 20, 2021

Strong growth forecast for IC industry on tight capacity, pent-up demand

Pent-up demand and mis-timed capacity investment could cause rapid IC industry growth.

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January 19, 2021

Design house recommends earlier start to flip-chip bump layout

Design-services company Sondrel is recommending teams start earlier on package design to avoid delays after IC tapeout.

January 15, 2021

Copper’s future is troubled but it’s likely to stick around

The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it’s not an obvious switch.

January 14, 2021

A new methodology addresses the increasing challenge of reset domain crossing

Originally presented at DVCon Europe, a new paper automates complex steps in RDC verification and reduces noise.

December 21, 2020

Plasmonics may point way to faster interchip comms

Work by the University of Toronto and Arm presented at IEDM indicates plasmonics could be a viable contender for high-speed chip-chip communications.

December 18, 2020

Backside metal defends against IR drop and side-channel attacks

Work presented at IEDM 2020 shows taking advantage of the IC backside for power and ground for the additional area can deliver further benefits for IR drop and security.

December 18, 2020

Virtual emulation delivers verification for the latest storage devices

Computational storage devices are posing a new raft of challenges that is being addressed using a powerful pre-silicon methodology.

December 17, 2020

Arm expands cloud migration on Arm-based machines at AWS

Arm is pushing more work onto Arm servers in the AWS cloud as it encourages EDA vendors to port their tools to the architecture.

December 17, 2020

Macronix proposes 3D to breathe life back into NOR flash

At IEDM this year, Macronix showed how a 3D architecture may bring back NOR flash, which stopped scaling a decade ago.

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