Samsung moves further into 3D for denser flash
Samsung described at VLSI Symposia how it has used two further forms of stacking to increase flash capacity.
Tech Design Forum Briefing
Briefing Authors
Paul Dempsey
Paul Dempsey has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
Luke Collins
Luke Collins is a freelance technology journalist with 22 years’ experience. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the IP9x series of conferences.
Chris Edwards
Chris Edwards has spent two decades covering electronics and EDA. He is a former Editor-in-Chief of Electronic Engineering Times UK and electronics editor of the IET's Engineering & Technology.
Imec cuts transistor gap to less than 20nm with forksheets
Imec showed at VLSI Symposia a process flow that can cut the gap between complementary transistors to less than 20nm.
AI’s design speedups, with and without machine learning
At the VLSI Symposia, researchers described how AI hardware could help dramatically accelerate analog and digital design and not all of it directly through machine learning.
Xilinx retools Versal for high-end edge AI
Xilinx has reworked its Versal FPGA for edge-AI applications.
TSMC spins outs processes for automotive and RF
TSMC is developing processes for high-end automotive and RF based off its N5 and N7 families.
IEDM looks for papers across 2D devices to 3DICs
IEDM has issued a call for papers for what the organizers expect to be an in-person event in December.
Three libraries tune speed and density on TSMC’s 3nm process
TSMC will provide three different standard-cell libraries for its upcoming finFET-based 3nm process to cover requirements from high-density mobile to high-performance computing, allowing tradeoffs for area and circuit frequency.
Would you prefer a hypervisor or a multicore framework?
Determining which embedded technique to adopt is more than just a question of what cores the system has.
PCIe 6.0 gets verification IP as formal arrival approaches
Questa suite of VIP adds PC and enterprise protocol as players prep designs for 2023 release.
Arm rolls clickthrough license scheme into Flexible Access
Arm is reworking the DesignStart scheme it introduced several years, moving it under the umbrella of the broader Flexible Access program.
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