SIP

September 8, 2022

Module verification demands integrated DRC and LVS

The system-in-package and module trends in system design promote bringing together physical (DRC) and electrical (LVS) verification.
April 28, 2022

Go inside proposals for common chiplet models

Chiplets will need models to guarantee heterogenous SiP implementation. A cross-industry working group describes its progress so far.
December 31, 2021

AMD moves gradually into 3D integration

At December's Design Automation Conference, AMD senior vice president Sam Naffziger provided more insights into the chipmaker’s use of chiplet-based design and manufacture.
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November 8, 2021

Chiplets may have to prove themselves for secure operation

University of Florida researcher proposes third-party checks on chiplets to demonstrate they are free of trojans.
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July 19, 2021

Chiplet design raises big questions

Building products using chiplets involves more than treating them as hard IP cores. Many open questions surround the field, explored by panelists in a MEPTEC conference online.
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July 15, 2021

Chiplets to need digital twins for reliability

The added complexity of managing reliability as chiplet-based designs become more common will need to be managed using digital-twin techniques, says a professor working in the field.
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July 13, 2020

Heterogeneous integration calls for new approaches

Heterogeneous integration has the potential to overcome the yield and cost challenges presented by the growing headwinds associated with process scaling. But it may take a dramatic rethink in design approaches.
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July 8, 2020

Scaling costs tip balance toward chiplets for AMD server processors

In a panel session at VLSI Symposia, AMD described how the economics have come down strongly in favor of multichip integration for multicore server processors.
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March 18, 2019

PCI may provide key to OCP chiplet standard

The ODSA Workgroup formed by Netronome and others is looking to adopt the PIPE standard for interconnecting chiplets as it starts work on a proof-of-concept module.
November 6, 2018

Netronome launches chiplet initiative for network-accelerator SIPs

Data-center networking specialist Netronome has recruited a number of silicon makers and IP suppliers to a standard for chiplet designs that can be used in SIPs for edge computers and servers.
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