Chipletz pushes packaging design for AI, HPC and immersive use-cases
The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.
Case Study
A new methodology addresses the increasing challenge of reset domain crossing
Originally presented at DVCon Europe, a new paper automates complex steps in RDC verification and reduces noise.
ROHM eases component choice by offering cloud simulation and collaboration environment
A Japanese component supplier is making it easier for its customers to choose the right parts for their designs by offering a powerful analog and mixed-signal (AMS) simulation environment through its website.
How to handle PCB constraints for IoT designs
An RF Laboratories engineer provides some tips and techniques in the context of the PADS Professional suite.
Litho hotspot analysis gets machine-learning turbocharge
A Mentor-Samsung collaboration cuts the need for model-based analysis and speeds analysis runtime by as much as 20X.
How to update legacy automotive designs for functional safety
Updates to existing designs are often error-prone, though safety tolerances are necessarily tightening. This four-step strategy can help.
Taking an IoT edge design from proof-of-concept to prototype
A new paper describes a case study for a pressure-sensing IoT application based on the ARM DesignStart platform and Mentor IoT tool flow.
Synopsys gets big-chip signoff boost from Innovium
Data-centre networking chip goes through full-chip design rule checking and layout-versus-schematic signoff on TSMC's 16nm finFET process in a day.
IP choice drives SSD controller design
Two-year-old design house make IP choice to use Synopsys DesignWare to build an enterprise SSD controller from scratch.
Discover how ST adapted HLS for automotive imaging
ST has tweaked its standard HLS flow for ISPs to meet the requirements of ISO 26262
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