November 20, 2023
South Korea's leading research institute has built a reusable flow for lower power petaflops-performance AI.
October 24, 2023
Chiplet-based 3DIC designs present new challenges for flows that integrate tasks from design exploration to physical verification.
November 23, 2022
The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.