Packaging


November 20, 2023

ETRI builds flow for AI chiplets

South Korea's leading research institute has built a reusable flow for lower power petaflops-performance AI.
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October 24, 2023

Flow evolution for the 3DIC/chiplet age

Chiplet-based 3DIC designs present new challenges for flows that integrate tasks from design exploration to physical verification.
November 23, 2022

Chipletz pushes packaging design for AI, HPC and immersive use-cases

The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.
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