As first silicon success declines, new software aims to provide a more holistic view of coverage data from multiple sources.
The key to exploiting AI is being clear about where its family of technologies can help to improve and democratize design.
New Quality Package focuses on safety and cybersecurity compliance with EU and US medical device standards.
The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.
Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.
The system-in-package and module trends in system design promote bringing together physical (DRC) and electrical (LVS) verification.
Equivalence checking supports the efficient reuse of designs that reside on out-of-date silicon but remain valid in their own right.
5G IC designs have needed aggressive innovation across many elements and more use of FD-SOI that both pose parasitic extraction challenges.
Learn how one of the leading tool vendors addresses the security of its products and customer data through a ground-up cybersecurity strategy.
Intel's Pathfinder for RISC-V is intended to boost the use of the architecture among a wider range of SoC design teams.
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