Siemens EDA has launched a second version of its Symphony simulation environment designed to support quicker debug cycles.
Aki Fujimura of mask specialist D2S sees curved shapes as key to improving die yield and performance but it needs EDA support.
CXL is a strongly-backed technology aimed at improving connectivity across datacenters handling high demand HPC and AI applications.
TSMC has certified the Aprisa place-and-route software from Siemens Digital Industries Software for the N5 and N4 process technologies.
Siemens has expanded its Nucleus ReadyStart program to the RISC-V architecture.
Variable lifetimes are an apparently basic but also tricky feature within the verification language.
Chiplets will need models to guarantee heterogenous SiP implementation. A cross-industry working group describes its progress so far.
The NVMe 2.0 specification has introduced two namespace options that boost SSD performance while optimizing storage life.
A new white paper offers useful tips and techniques for PDN analysis and performance optimization in designs such as those using DDR4.
Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.
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