Siemens EDA

Siemens is integrating the Supplyframe platform with the Xpedition PCB-design software to give engineers better visibility into component availability.

Siemens has published a white paper that examines whether package designers need to adopt IC tools and design styles in the move from organic packages to 2.5DIC packages.

A comprehensive review of ML's potential and its current use identifies challenges ahead.

The company says the mixed-signal platform enabled a 5X improvement in verification productivity.

There is no comprehensive standard yet for functional coverage across designs using SystemC, TLM, UVM and SystemVerilog, but there are options using UVM Connect.

As first silicon success declines, new software aims to provide a more holistic view of coverage data from multiple sources.

The key to exploiting AI is being clear about where its family of technologies can help to improve and democratize design.

New Quality Package focuses on safety and cybersecurity compliance with EU and US medical device standards.

The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.

Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.