Benchmarking the maturity of AI in EDA
Solido discusses how it has leveraged AI for SPICE level efficiency and the benchmarks it has used.
AI
ETRI builds flow for AI chiplets
South Korea's leading research institute has built a reusable flow for lower power petaflops-performance AI.
Siemens and CEA link up on AI-assisted digital twins
Siemens and CEA-List have signed a deal under which the two organisations will research the combination of digital-twin and AI.
HPC and AI provide keynote focus at DVCon Europe
DVCon Europe has announced its two keynote presentations, focusing on energy-efficient high-performance computing and machine learning.
Cadence mixes know-how and AI to bridge RTL gap
The Joules RTL Design Studio aims to make coding more aware of aware of physical issues before and after hand-off for implementation.
Siemens fuels custom IC flows with artificial intelligence
Three fast developing AI techniques underpin the efficiencies in the new Solido custom design and verification platform.
Charting the path for machine learning in functional verification
A comprehensive review of ML's potential and its current use identifies challenges ahead.
Identifying AI opportunities in PCB design
The key to exploiting AI is being clear about where its family of technologies can help to improve and democratize design.
Chipletz pushes packaging design for AI, HPC and immersive use-cases
The Austin-based start-up used Siemens EDA software to deploy a cutting-edge Smart Substrate based on advanced packaging technology.
Devgan plans for optimization through machine learning
Cadence president expects expanded role for reinforcement learning in tool portfolio and looks for help on AI for verification.
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