September 27, 2022
Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.
January 15, 2021
The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.
December 21, 2020
Work by the University of Toronto and Arm presented at IEDM indicates plasmonics could be a viable contender for high-speed chip-chip communications.
October 17, 2017
Synopsys' line-up at next week's ARM TechCon includes joint presentations with Huawei and Nvidia.
June 3, 2015
Technology from Duolog acquisition used to ease the configuration of interconnect, debug and trace - and the integration of third-party IP
April 7, 2014
The 2013 edition of the International Technology Roadmap for Semiconductors has been published. The latest set of tables underlines the slowdown in some aspects of scaling, particularly when it comes to metal interconnect.