interconnect


January 15, 2021

Copper’s future is troubled but it’s likely to stick around

The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations: , , , ,
December 21, 2020

Plasmonics may point way to faster interchip comms

Work by the University of Toronto and Arm presented at IEDM indicates plasmonics could be a viable contender for high-speed chip-chip communications.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , , ,   |  Organizations: ,
October 17, 2017

Arm TechCon 2017 preview: Synopsys

Synopsys' line-up at next week's ARM TechCon includes joint presentations with Huawei and Nvidia.
June 3, 2015

ARM eases interconnect, debug, third-party IP integration for SoCs

Technology from Duolog acquisition used to ease the configuration of interconnect, debug and trace - and the integration of third-party IP
Article  |  Topics: Blog Topics  |  Tags: , , ,   |  Organizations: ,
April 7, 2014

Latest ITRS underlines slowdown in interconnect and IC scaling

The 2013 edition of the International Technology Roadmap for Semiconductors has been published. The latest set of tables underlines the slowdown in some aspects of scaling, particularly when it comes to metal interconnect.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations: , ,

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