The metal has done sterling service for 20 years but the time is approaching to find a replacement for copper as problems with parasitics continue to build up, work presented at last month’s IEDM shows. But it's not an obvious switch.
Work by the University of Toronto and Arm presented at IEDM indicates plasmonics could be a viable contender for high-speed chip-chip communications.
Synopsys' line-up at next week's ARM TechCon includes joint presentations with Huawei and Nvidia.
Technology from Duolog acquisition used to ease the configuration of interconnect, debug and trace - and the integration of third-party IP
The 2013 edition of the International Technology Roadmap for Semiconductors has been published. The latest set of tables underlines the slowdown in some aspects of scaling, particularly when it comes to metal interconnect.
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